Semiconductor device and a method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorShinya Suzuki
Life of this patent
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Abstract
A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a technique which guarantees the flatness of a bump electrode even when wiring lies in a top wiring layer under the bump electrode, thereby improving the reliability in coupling between the bump electrode and the wiring formed on a glass substrate. Wiring, comprised of a power line or signal line, and a dummy pattern are formed in a top wiring layer beneath a non-overlap region of a bump electrode. The dummy pattern is located to fill the space between wirings to reduce irregularities caused by the wirings and space in the top wiring layer. A surface protection film formed to cover the top wiring layer is flattened by CMP.
Claims15
A semiconductor device comprising:
- (a) a semiconductor substrate;
- (b) a semiconductor element formed over the semiconductor substrate;
- (c) a first wiring formed over the semiconductor element;
- (d) a first insulating film formed over the semiconductor substrate to cover the semiconductor element and the first wiring;
- (e) a pad formed over the first insulating film;
- (f) a second insulating film having a portion formed over the pad and an opening which reaches the pad;
- and
- (g) a bump electrode formed over the second insulating film and electrically coupled to the pad by way of the opening,
- wherein in a same layer as the pad, a second wiring and a dummy pattern different from the second wiring are formed,
- wherein respective portions of the second wiring and the dummy pattern are disposed under the bump electrode, and
- wherein a long side of the dummy pattern extends in a direction transverse to a long-side direction of the second wiring in a plan view.
A semiconductor device including a rectangular semiconductor chip having long edges and short edges in a plan view,
- the semiconductor chip comprising:
- (a) a rectangular semiconductor substrate having a pair of short edges and a pair of long edges;
- (b) a semiconductor element formed over the semiconductor substrate;
- (c) a first wiring formed over the semiconductor element;
- (d) a first insulating film formed over the semiconductor substrate to cover the semiconductor element and the first wiring;
- (e) a plurality of pads formed over the first insulating film;
- (f) a second insulating film having respective portions formed over the pads and a plurality of openings which reach corresponding pads;
- and
- (g) a plurality of rectangular bump electrodes which are formed over the second insulating film and electrically coupled to the pads by way of the corresponding openings,
- wherein, in a same layer as the pads, a second wiring comprised of a power line or a signal line and first dummy patterns different from the second wiring are formed,
- wherein the bump electrodes are arranged in line at least in a long edge direction of the semiconductor chip, with long edges of the bump electrodes being parallel to a short edge direction of the semiconductor chip,
- wherein each of the bump electrodes has an overlap region which overlaps a corresponding pad in the plan view and a non-overlap region which does not overlap the corresponding pad in the plan view,
- wherein the second wiring extends in the long edge direction of the semiconductor chip and has portions disposed under the non-overlap regions of the bump electrodes,
- wherein each of the first dummy patterns is formed, respectively, in an area which does not overlap any of the bump electrodes in the plan view and is between the non-overlap regions of the bump electrodes in the plan view, and
- wherein a long side of each of the first dummy patterns extends in a direction transverse to the long edge direction in the plan view.
Dependencies are inferred from the claim text.