Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device

A semiconductor device comprising:

• a unit lead frame having a die pad, suspension leads coupled to the die pad, and leads formed around the die pad;
• a semiconductor element mounted over the die pad of the unit lead frame;
• and
• sealing resin for sealing the unit lead frame and the semiconductor element,
• wherein an identification mark including at least one of a penetrating groove, recess, and convex is formed in at least one of the die pad, the suspension leads, and the leads, and
• wherein the identification marks of at least two of a plurality of the semiconductor devices are different from each other at least either in location in the unit lead frame or in shape.

A method of manufacturing a semiconductor device, comprising the steps of:

• providing a lead frame in which a plurality of unit lead frames are formed, each unit lead frame having a die pad, suspension leads coupled to the die pad, and leads formed around the die pad;
• mounting a semiconductor element over each of a plurality of the die pads;
• after mounting the semiconductor element, sealing the unit lead frames and the semiconductor elements with sealing resin;
• and
• after sealing the unit lead frames and the semiconductor elements, dicing into pieces as the unit lead frames,
• wherein in the lead frame, an identification mark including at least one of a penetrating groove, recess, and convex is formed in at least one of the die pad, the suspension leads, and the leads, and
• wherein the identification mark of a first one of the unit lead frames and the identification mark of a second one of the unit lead frames are different from each other at least either in location in the unit lead frame or in shape.