Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

A method of fabricating a power device package, the method comprising:

• forming a wiring pattern on a first surface of a thermal electric module, the thermal electric module having a second surface opposite to the first surface, a plurality of n-type impurity elements, and a plurality of p-type impurity elements, the n-type impurity elements and the p-type impurity elements being alternately and electrically connected to each other in series;
• mounting one or more power semiconductor chips on the thermal electric module so as to electrically connect to the wiring pattern;
• assembling a first portion of a lead frame and the first surface of the thermal electric module together using a conductive adhesive member so that the first portion of the lead frame and the wiring pattern are electrically connected;
• electrically connecting one or more control semiconductor chips disposed to a second portion of the lead frame or the wiring pattern, or both, to control the one or more power semiconductor chips, wherein the first and second portions of the lead frame are electrically connected using wiring;
• connecting the second portion of the lead frame and the thermal electric module using power wiring;
• sealing the thermal electric module, the power semiconductor chips, the control semiconductor chips and a portion of the lead frame with a sealing member so as to expose the second surface of the thermal electric module;
• and
• providing a heat sink adjacent the thermal electric module.