Back to results
US 8,552,537 B2Granted
Semiconductor device and method for fabricating the same
AssigneeKabushiki Kaisha Toshiba
InventorsTatsuo Shimizu, Satoshi Itoh, Hideyuki Nishizawa
Life of this patent
Estimating the term…
Abstract
A semiconductor device according to an embodiment, includes a dielectric film and an Si semiconductor part. The dielectric film is formed by using one of oxide, nitride and oxynitride. The Si semiconductor part is arranged below the dielectric film, having at least one element of sulfur (S), selenium (Se), and tellurium (Te) present in an interface with the dielectric film, and formed by using silicon (Si).
Claims7
A semiconductor device, comprising:
- a plurality of silicon (Si) semiconductor parts arranged on a substrate, formed in a wire-shaped structure, and in which at least one element of sulfur (S), selenium (Se), and tellurium (Te) is present on a surface portion;
- and
- a plurality of dielectric films respectively formed as if to cover a corresponding Si semiconductor part of the plurality of Si semiconductor parts and in contact with a surface portion of the corresponding Si semiconductor part of the plurality of Si semiconductor parts to form an interface with the corresponding Si semiconductor part of the plurality of Si semiconductor parts,
- wherein the plurality of Si semiconductor parts is arranged in a vertical direction with respect to a substrate surface;
- and further comprising:
- a plurality of charge accumulation films respectively formed as if to cover a corresponding dielectric film of the plurality of dielectric films;
- a plurality of interelectrode dielectric films respectively formed as if to cover a corresponding charge accumulation film of the plurality of charge accumulation films;
- and
- a control electrode formed as if to cover the plurality of interelectrode dielectric films.
6 more elements
Dependencies are inferred from the claim text.