Laminated semiconductor substrate, semiconductor substrate, laminated chip package and method of manufacturing the same

A semiconductor substrate having a plurality of scribe-groove parts formed along scribe lines,

• a plurality of device regions each in contact with at least one of the plurality of scribe-groove parts, having a semiconductor device formed therein, formed in a rectangular shape, and insulated;
• and
• a plurality of wiring electrodes connected to the semiconductor devices respectively formed in the plurality of device regions and extending from the device regions into the inside of the scribe-groove parts,
• wherein the plurality of wiring electrodes are arranged in a partial arrangement pattern in which the wiring electrodes are arranged along only a part of four boundary sides corresponding to boundaries between each of the device regions and the scribe-groove parts for each of the plurality of device regions, and extend into the scribe-groove part from only one of two device regions adjacent to each other with the scribe-groove part therebetween among the plurality of device regions.

A laminated chip package comprising a plurality of semiconductor chips,

• each of the plurality of semiconductor chips comprising:
• a resin insulating layer made of an insulating resin formed to surround a periphery of a device region in a rectangular shape in which the semiconductor device is formed;
• and
• a plurality of wiring electrodes connected to the semiconductor device and having end parts arranged on the resin insulating layer,
• wherein the plurality of wiring electrodes are arranged in a partial arrangement pattern in which the wiring electrodes are arranged along only a part of four boundary sides corresponding to boundaries between the device region and the resin insulating layer, and two boundary sides connected in an L-figure like among the four boundary sides in the device region are set as electrode sides along which the wiring electrodes are arranged and two boundary sides other than the electrode sides are set as electrodeless sides along which the wiring electrodes are not arranged,
• the laminated chip package comprising:
• a through hole formed therein which penetrates the resin insulating layers of the plurality of semiconductor chips laminated in a laminated direction in which the plurality of semiconductor chips are laminated, and in which a plurality of the wiring electrodes, constituting a laminated electrode group laminated in the laminated direction among the wiring electrodes, appear;
• and
• a through electrode which penetrates all of the plurality of semiconductor chips through the through hole and is in contact with all of the wiring electrodes appearing in the through hole.

A method of manufacturing a laminated semiconductor substrate, comprising:

• a device region forming step of forming a plurality of scribe-groove parts along scribe lines in an unprocessed substrate having semiconductor devices formed therein to form a plurality of device regions each of which is in contact with at least one of the plurality of scribe-groove parts and has the semiconductor device formed therein;
• a substrate manufacturing step of manufacturing a substrate with electrode by forming a plurality of wiring electrodes connected to the semiconductor devices respectively formed in the plurality of device regions and extending from the device regions into the inside of the scribe-groove parts, such that the plurality of wiring electrodes are arranged, for each of the plurality of device regions, in a partial arrangement pattern in which the wiring electrodes are arranged along only a part of four boundary sides corresponding to boundaries between each of the device regions and the scribe-groove parts, and extend into the scribe-groove part from only one of two device regions adjacent to each other with the scribe-groove part therebetween;
• a laminating step of laminating a plurality of the substrates with electrode to manufacture a laminated wafer;
• a through hole forming step of forming, for the laminated wafer, a through hole which penetrates the scribe-groove parts of the plurality of substrates with electrode laminated in a laminated direction in which the plurality of substrates with electrode are laminated, and in which a plurality of the wiring electrodes, constituting a laminated electrode group laminated in the laminated direction among the wiring electrodes, appear;
• and
• a through electrode forming step of forming a through electrode in contact with all of the wiring electrodes appearing in the through hole such that the through electrode penetrates all of the plurality of substrates with electrode through the through hole.