Semiconductor package to remove power noise using ground impedance
AssigneeSamsung Electronics Co., Ltd.
InventorsEun-seok Song, Hee-seok Lee, Sung-woo Park
Life of this patent
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Abstract
A semiconductor package removes power noise by using a ground impedance. The semiconductor package includes an analog circuit block, a digital circuit block, an analog ground impedance structure, a digital ground impedance structure, and an integrated ground. The integrated ground and the analog circuit block are electrically connected via the analog ground impedance structure, and the integrated ground and the digital circuit block are electrically connected via the digital ground impedance structure, and an inductance of the analog ground impedance structure is greater than an inductance of the digital ground impedance structure.
Claims21
A semiconductor package comprising:
- a digital circuit block and an analog circuit block;
- an integrated ground to provide an equipotential voltage to the digital circuit block and the analog circuit block;
- a digital ground impedance structure that electrically connects the digital circuit block to the integrated ground;
- an analog ground impedance structure that has a greater inductance than the digital ground impedance structure and electrically connects the analog circuit block to the integrated ground;
- and
- an external terminal connected to the integrated ground, the external terminal to provide a ground potential to both of the digital circuit block and the analog circuit block,
- wherein the analog ground impedance structure has a shape different than the digital ground impedance structure.
A semiconductor package comprising:
- at least one digital semiconductor chip including a first ground chip pad;
- at least one analog semiconductor chip including a second ground chip pad;
- an integrated ground layer to provide an equipotential voltage to the at least one digital semiconductor chip and the at least one analog semiconductor chip;
- a digital ground impedance structure that electrically connects the integrated ground layer to the first ground chip pad;
- an analog ground impedance structure that has greater inductance than the digital ground impedance structure and that electrically connects the integrated ground layer to the second ground chip pad;
- and
- an external terminal connected to the integrated ground layer, the external terminal to provide a ground potential to both of the digital semiconductor chip and the analog semiconductor chip,
- wherein the analog ground impedance structure has a shape different than the digital ground impedance structure.
A semiconductor package comprising:
- at least one digital semiconductor chip including a first ground chip pad;
- at least one analog semiconductor chip including a second ground chip pad;
- an integrated ground layer to provide an equipotential voltage to the at least one digital semiconductor chip and the at least one analog semiconductor chip;
- a first conductive wire that electrically connects the integrated ground layer to the first ground chip pad;
- a second conductive wire that has greater inductance than the first conductive wire and electrically connects the integrated ground layer to the second ground chip pad;
- and
- an external terminal connected to the integrated ground layer, the external terminal to provide a ground potential to both of the digital semiconductor chip and the analog semiconductor chip
- wherein the first conductive wire is longer than the second conductive wire.
A computing device, comprising:
- a semiconductor package comprising:
- an analog circuit block;
- a digital circuit block;
- an integrated ground connected to each of the analog circuit block and the digital circuit block;
- a first impedance structure located along an electrical path between the digital circuit block and the integrated ground;
- and
- a second impedance structure located along an electrical path between the analog circuit block and the integrated ground, the second impedance structure having an inductance greater than the first impedance structure;
- a controller to control operation of the analog circuit block and the digital circuit block;
- and
- an external terminal connected to the integrated ground, the external terminal to provide a ground potential to both of the digital circuit block and the analog circuit block,
- wherein the first impedance structure has a shape different than the second impedance structure.
Dependencies are inferred from the claim text.