Conductive paste and mold for electrical connection of photovoltaic die to substrate

A CPV module, comprising:

• a substrate comprising a conductive layer having first and second sections, the first and second sections disposed in spaced relation to each other with a gap defined therebetween;
• a photovoltaic receiver die having a first surface and a second surface opposite to the first surface, wherein the second surface is mounted and electrically connected to the conductive first section of the substrate;
• a mold body at least partially covering the substrate and the photovoltaic receiver die and defining a reservoir having a portion of the photovoltaic receiver die exposed therein, the mold body comprising:
• an inner portion that partially covers the photovoltaic receiver die and disposed within at least a portion the gap;
• and
• an outer portion separated from the inner portion by a pair of channels each laterally spaced apart from the photovoltaic receiver die and adjoining the conductive second section of the substrate;
• and
• a conductive material further disposed in the pair of channels to electrically connect the first surface of the photovoltaic receiver die to the second section of the substrate.

A CPV module, comprising:

• a substrate;
• a light receiving die having opposing first and second surfaces, the second surface electrically connected to a conductive first section the substrate;
• and
• a mold body that at least partially covers the substrate and accommodates the light receiving die, wherein the mold body comprises:
• an inner portion that partially covers the light receiving die;
• and
• an outer portion separated from the inner portion by at least one channel, wherein the at least one channel is laterally spaced apart from the light receiving die and adjoins a conductive second section of the substrate that is electrically isolated from the conductive first section;
• and
• a conductive material disposed in the at least one channel to electrically connect the first surface of the light receiving die to the conductive second section of the substrate.