Semiconductor physical quantity sensor
AssigneeDenso Corporation
InventorKouji Ooya
Life of this patent
Estimating the term…
Abstract
A semiconductor physical quantity sensor includes a sensor chip, a support member for fixing the sensor chip to a fixing position and an adhesive bonding the sensor chip with the support member. The sensor chip includes a semiconductor substrate and a chip base supporting the semiconductor substrate. The semiconductor substrate is provided with a sensing portion for detecting a physical quantity. The chip base is bonded with the support member through the adhesive. The adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin.
Claims10
A semiconductor physical quantity sensor comprising:
- a sensor chip including a semiconductor substrate and a chip base that supports the semiconductor substrate, the semiconductor substrate being provided with a sensing portion for detecting a physical quantity;
- a support member supporting the sensor chip;
- and
- an adhesive bonding the chip base with the support member, wherein
- the adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin, and
- the cross-linked resin is a cross-linked polyacrylic ester.
A semiconductor physical quantity sensor comprising:
- a sensor chip including a semiconductor substrate and a chip base that supports the semiconductor substrate, the semiconductor substrate being provided with a sensing portion for detecting a physical quantity;
- a support member supporting the sensor chip;
- and
- an adhesive bonding the chip base with the support member, wherein
- the adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin, and
- the granular material includes hollow spherical particles.
A semiconductor physical quantity sensor comprising:
- a sensor chip including a semiconductor substrate and a chip base that supports the semiconductor substrate, the semiconductor substrate being provided with a sensing portion for detecting a physical quantity;
- a support member supporting the sensor chip;
- and
- an adhesive bonding the chip base with the support member, wherein
- the adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin, and
- the granular material includes solid spherical particles.
A semiconductor physical quantity sensor comprising:
- a sensor chip including a semiconductor substrate and a chip base that supports the semiconductor substrate, the semiconductor substrate being provided with a sensing portion for detecting a physical quantity;
- a support member supporting the sensor chip;
- and
- an adhesive bonding the chip base with the support member, wherein
- the adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin,
- the adhesive base material is mainly made of a rubber-base element, and
- the rubber-base element is a fluorosilicone rubber.
A semiconductor physical quantity sensor comprising:
- a sensor chip including a semiconductor substrate and a chip base that supports the semiconductor substrate, the semiconductor substrate being provided with a sensing portion for detecting a physical quantity;
- a support member supporting the sensor chip;
- and
- an adhesive bonding the chip base with the support member, wherein
- the adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin,
- the adhesive base material is mainly made of a rubber-base element, and
- the rubber-base element is a silicone rubber.
A semiconductor physical quantity sensor comprising:
- a sensor chip including a semiconductor substrate and a chip base that supports the semiconductor substrate, the semiconductor substrate being provided with a sensing portion for detecting a physical quantity;
- a support member supporting the sensor chip;
- and
- an adhesive bonding the chip base with the support member, wherein
- the adhesive is provided by a mixture of an adhesive base material mainly made of a resin and a granular material mainly made of a cross-linked resin,
- the adhesive base material is mainly made of a rubber-base element, and
- the rubber-base element is a fluororubber.
Dependencies are inferred from the claim text.