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US 8,552,489 B2Granted
Vertical channel memory devices with nonuniform gate electrodes
AssigneeSamsung Electronics Co., Ltd.
InventorsDaehong Eom, Kyunghyun Kim, Kwangsu Kim, Jun-Youl Yang, Se-Ho Cha
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Abstract
A mold stack including alternating insulation layers and sacrificial layers is formed on a substrate. Vertical channel regions extending through the insulation layers and sacrificial layers of the mold stack are formed. Gate electrodes are formed between adjacent ones of the insulation layers and surrounding the vertical channel regions. The gate electrodes have a greater thickness at a first location near sidewalls of the insulation layers than at a second location further away from the sidewalls of the insulation layers.
Claims5
A memory device comprising:
- vertically-spaced insulation layers stacked on a substrate;
- vertical channel regions extending through the insulation layers and electrically connected to the substrate;
- gate electrodes disposed between adjacent ones of the insulation layers surrounding the vertical channel regions;
- and
- at least one data storage layer disposed between the gate electrodes and the vertical channel regions, wherein the gate electrodes have a greater thickness at a first location near sidewalls of the insulation layers than at a second location farther away from the sidewalls of the insulation layers.
2 more elements
Dependencies are inferred from the claim text.