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US 8,552,463 B2Granted
Electronic devices with yielding substrates
AssigneeCooledge Lighting Inc.
InventorsMichael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
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Abstract
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Claims31
An electronic device comprising:
- an inorganic light-emitting diode (LED) having first and second spaced-apart contacts;
- and
- a flexible substrate having first and second conductive traces on a first surface thereof in a bonding region, the first and second conductive traces being separated on the substrate by a gap therebetween,
- wherein (i) the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with a pressure-activated adhesive material without electrically bridging the traces or the contacts and (ii) at least in the bonding region, a height of the first and second traces above the first surface of the substrate does not exceed 10 μm and (iii) the electrical contact between the contacts and the traces is maintained during operation of the LED notwithstanding the height of the first and second traces above the first surface of the substrate.
1 more element
Dependencies are inferred from the claim text.