LED package and method for manufacturing the same
AssigneeAdvanced Optoelectric Technology, Inc.
InventorsHou-Te Lin, Ming-Ta Tsai
Life of this patent
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Abstract
An LED package includes an electrode, an LED chip, and an insulation layer. The electrode includes a first electrode and a second electrode. The first electrode and the second electrode are separate from each other. The LED chips are connected to the first and second electrodes. The insulation layer covers the first and second electrodes and the LED chip. A cavity is defined in the first electrode for receiving the LED chip therein. A channel is defined between the first electrode and the second electrode. The channel communicates with the cavity and the insulation layer fills in the cavity and the channel.
Claims8
An LED package, comprising:
- an electrode, a connection electrode, a lens, an LED chip, and an insulation layer, the electrode including a first electrode and a second electrode, the first electrode and the second electrode arranged with intervals mutually, the connection electrode including a first connection electrode and a second connection electrode, the first connection electrode and the second connection electrode being arranged on top surfaces of the first electrode and the second electrode, top surfaces of the first connection electrode and the second connection electrode being at a same horizontal level, the lens being attached to the top surfaces of the first connection electrode and the second connection electrode, the LED chip connected electrically to the electrode via the connection electrode, the insulation layer encapsulating the electrode and the LED chip, wherein a cavity is arranged on the first electrode, the LED chip is arranged within the cavity, a channel is defined between the first electrode and the second electrode, the channel communicates with the cavity, the insulation layer is filled into the cavity and the channel.
Dependencies are inferred from the claim text.