Side by side light emitting diode (LED) having separate electrical and heat transfer paths

A light emitting diode comprising:

• a thermal conductive substrate having at least one electrical isolation layer configured to provide a heat transfer path through the substrate from a first side to a second side thereof;
• an anode through interconnect from the first side to the second side;
• a cathode through interconnect from the first side to the second side, the anode through interconnect and the cathode through interconnect located side by side on the substrate;
• and
• a LED chip mounted to the first side in electrical communication with the anode through interconnect and with the cathode through interconnect;
• wherein the thermal conductive substrate comprises n-type silicon having a p+layer in electrical communication with the cathode through interconnect, and an n+layer in electrical contact with the LED chip and in electrical communication with the anode through interconnect configured to form a zener diode.

A light emitting diode comprising:

• a thermal conductive substrate having at least one electrical isolation layer configured to provide a heat transfer path through the substrate from a first side to a second side thereof;
• an anode through interconnect from the first side to the second side;
• a cathode through interconnect from the first side to the second side, the anode through interconnect and the cathode through interconnect located side by side on the substrate;
• and
• a LED chip mounted to the first side in electrical communication with the anode through interconnect and with the cathode through interconnect;
• wherein the thermal conductive substrate comprises p-type silicon having an n+layer in electrical communication with the cathode through interconnect, and an p+layer in electrical contact with the LED chip and in electrical communication with the anode through interconnect configured to form a zener diode.

A light emitting diode comprising:

• a semiconductor substrate having a first side, a second side, an isolation layer on the first side configured to provide vertical electrical isolation and a heat transfer path from the first side to the second side;
• an anode through interconnect comprising a first via from the first side to the second side at least partially filled with a first metal bump;
• a cathode through interconnect comprising a second via from the first side to the second side at least partially filled with a second metal bump;
• a LED chip mounted to the first side between and in electrical communication with the anode through interconnect and the cathode through interconnect;
• and
• a zener diode comprising an inner first type silicon layer on the first side in electrical contact with the cathode through interconnect, and an outer second type silicon layer on the first side in electrical contact with the anode through interconnect and with the LED chip.