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US 8,552,450 B2Granted
LED package structure with a fuse for protection from high current
AssigneeEverlight Electronics Co., Ltd.
InventorSsu-Yuan Weng
Life of this patent
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Abstract
An LED package structure comprises an LED chip and a fuse electrically connected to the LED chip in series. The fuse has a low melting point such that the fuse melts under a high current to form an open circuit to prevent the high current from flowing through the LED chip.
Claims12
A light emitting diode (LED) package structure, comprising:
- an LED chip;
- and
- a fuse electrically connected to the LED chip in series, the fuse alternatively changing between being electrically conductive and being electrically non-conductive depending on a temperature of the fuse;
- and a lead frame having a first lead pin, a second lead pin, and a loading part connected to the first lead pin;
- the LED chip is disposed on the loading part of the lead frame, wherein the loading part has a triangular profile when viewed from a side, and wherein the fuse is disposed on the first lead pin of the lead frame.
2 more elements
A light emitting diode (LED) package structure, comprising:
- a lead frame having a first lead pin, a second lead pin, and a loading part connected to the first lead pin;
- an LED chip disposed on the lead frame;
- and
- a fuse disposed on the lead frame and electrically connected to the LED chip in series between the first lead pin and the second lead pin of the lead frame, the fuse alternatively changing between being electrically conductive and being electrically non-conductive depending on a temperature of the fuse;
- and the LED chip is disposed on the loading part of the lead frame, wherein the loading part has a triangular profile when viewed from a side, and wherein the fuse is disposed on the first lead pin of the lead frame.
2 more elements
Dependencies are inferred from the claim text.