Package of light emitting diode and method for manufacturing the same
AssigneeLG Innotek Co., Ltd.
InventorBo Geun Park
Life of this patent
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Abstract
Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.
Claims19
A package of a light emitting diode, the package comprising:
- a base layer including an entire top surface that is substantially flat;
- a semiconductor light emitting diode chip on the base layer;
- a lead frame electrically connected to the semiconductor light emitting diode chip;
- and
- a coating layer comprising titanium oxide,
- wherein a topmost surface of the coating layer is substantially parallel to the top surface of the base layer,
- wherein a lateral width of the coating layer is larger than a thickness from a bottommost surface to the topmost surface of the coating layer,
- wherein a shortest lateral width of the coating layer is larger than the thickness from the bottommost surface to the topmost surface of the coating layer, and
- wherein the entire bottommost surface of the coating layer is positioned higher than a top surface of the semiconductor light emitting diode chip.
A display device comprising:
- a package of a light emitting diode, the package including,
- a base layer including an entire top surface that is substantially flat;
- a semiconductor light emitting diode chip on the base layer;
- a lead frame electrically connected to the semiconductor light emitting diode chip;
- and
- a coating layer comprising titanium oxide,
- wherein a topmost surface of the coating layer is substantially parallel to the top surface of the base layer,
- wherein a lateral width of the coating layer is larger than a thickness from a bottommost surface to the topmost surface of the coating layer,
- wherein the thickness from the bottommost surface to the topmost surface of the coating layer is thinner than a thickness from a bottom surface to a topmost surface of the semiconductor light emitting diode chip, and
- wherein the entire bottommost surface of the coating layer is positioned higher than a top surface of the semiconductor light emitting diode chip.
A package of a light emitting diode, the package comprising:
- a base layer including an entire top surface that is substantially flat;
- a semiconductor light emitting diode chip on the base layer;
- a lead frame electrically connected to the semiconductor light emitting diode chip;
- and
- a coating layer comprising titanium oxide,
- wherein an entire bottommost surface of the coating layer is positioned higher than a top surface of the semiconductor light emitting diode chip, and
- wherein ends of the lead frame and coating layer are substantially aligned with each other.
Dependencies are inferred from the claim text.