Back to results
US 8,552,439 B2Granted
Light-emitting diode package
AssigneesHimax Display, Inc., Himax Technologies Limited
InventorsYuet-Wing Li, Kuan-Hsu Fan-Chiang, Sin-Hua Ho
Life of this patent
Estimating the term…
Abstract
A light-emitting diode (LED) package including a substrate, an LED chip, a polarizer, and a supporter is provided. The LED chip is disposed on the substrate. The polarizer is disposed above the LED chip. The supporter is disposed on the substrate for supporting the polarizer.
Claims9
A light-emitting diode (LED) package comprising:
- a substrate;
- an LED chip disposed on the substrate;
- a polarizer disposed above the LED chip, wherein the polarizer is a wire-grid polarizer, and the wire-grid polarizer comprises:
- a transparent substrate;
- and
- a plurality of metal wires, each of the metal wires extending along a first direction, the metal wires being arranged along a second direction, the metal wires satisfying 0.2<d/λ<0.5, wherein d is a pitch of the metal wires along the second direction, and λ is a wavelength of a first light emitted by the LED chip;
- a fluorescent layer wrapping the LED chip, wherein the fluorescent layer converts the first light emitted by the LED chip into a second light, a wavelength of the first light is shorter than a wavelength of the second light, the metal wires satisfies 0.2<d/λ′<0.5, and λ′ is the wavelength of the second light;
- and
- a supporter disposed on the substrate for supporting the polarizer.
6 more elements
Dependencies are inferred from the claim text.