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US 8,552,436 B2Granted
Light emitting diode structure
AssigneeLuxVue Technology Corporation
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
Claims26
A structure comprising:
- a substrate layer;
- an array of posts, wherein each of the posts has a height between 0.2-4 μm, and the array of posts and the substrate layer are integrally formed from a single piece of material comprising a polymer material;
- a corresponding array of laterally separate metallization layers directly over the array of posts;
- and
- a semiconductor device layer directly over the array of laterally separate metallization layers, wherein the semiconductor device layer has a uniform thickness across the substrate layer.
2 more elements
Dependencies are inferred from the claim text.