Power semiconductor device
AssigneeMitsubishi Electric Corporation
InventorShigeto Honda
Life of this patent
Estimating the term…
Abstract
A power semiconductor device according to the present invention, which has a termination structure in which a field plate is provided on an insulating film filled in a recessed region formed in a semiconductor substrate and includes a plurality of unit cells connected in parallel, includes: a gate wiring region in which gate wiring electrically connected to each gate electrode of the plurality of unit cells is provided; and a gate pad region electrically connected to the gate wiring region, wherein the gate wiring region is disposed on the insulating film filled in a recessed region formed in the semiconductor substrate.
Claims5
A power semiconductor device, which has a termination structure in which a field plate is provided on an insulating film filled in a first recessed region formed in a semiconductor substrate and includes a plurality of unit cells connected in parallel, comprising:
- a gate wiring region in which gate wiring electrically connected to each gate electrode of said plurality of unit cells is provided;
- and
- a gate pad region electrically connected to said gate wiring region,
- wherein:
- said gate wiring region is disposed on said insulating film filled in a second recessed region formed in said semiconductor substrate;
- a first impurity region and a second impurity region are provided under said first recessed region and said second recessed region, respectively;
- and
- said first impurity region and said second impurity region are each a p-type region having a lower impurity concentration than that of a p-type active region of said unit cell.
Dependencies are inferred from the claim text.