US 8,552,312 B2Granted

Printed wiring board and method for manufacturing printed wiring board

AssigneeIbiden Co., Ltd.

InventorsSatoru Kawai, Yasuki Kimishima

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Abstract

A printed wiring board including a substrate having first and second surfaces and a penetrating hole extending through the substrate between the surfaces, a first conductive circuit on the first surface, a second conductive circuit on the second surface, and a through-hole conductor in the hole and connecting the first and second conductive circuits. The conductor includes an electroless plated film on the inner-wall surface of the hole, a first electrolytic plated film formed on the electroless plated film and forming a first opening portion opening on the first surface and a second opening portion opening on the second surface, a second electrolytic plated film filling the first portion, and a third electrolytic plated film filling the second portion. The first and second portions taper toward the central portion of the hole with respect to the axis direction of the hole and have cross sections forming a substantially U-shape, respectively.

Claims15

Dependent claims

A printed wiring board comprising:

a substrate having a first surface and a second surface on an opposite side of the first surface, the substrate having a penetrating hole extending through the substrate between the first surface and the second surface;
a first conductive circuit formed on the first surface of the substrate;
a second conductive circuit formed on the second surface of the substrate;
and
a through-hole conductor formed in the penetrating hole of the substrate and connecting the first conductive circuit and the second conductive circuit,
wherein the through-hole conductor comprises an electroless plated film formed on an inner-wall surface of the penetrating hole, a first electrolytic plated film formed on the electroless plated film and forming a first opening portion which opens on the first surface, a second opening portion which opens on the second surface and a connection portion partitioning the first opening portion and the second opening portion, a second electrolytic plated film filled in the first opening portion of the first electrolytic plated film, and a third electrolytic plated film filled in the second opening portion of the first electrolytic plated film, and the first opening portion and the second opening portion taper toward a central portion of the penetrating hole with respect to an axis direction of the penetrating hole and have cross sections forming a substantially U-shape, respectively.

3 more elements

A method for manufacturing a printed wiring board, comprising:

providing a substrate having a first surface, a second surface on an opposite side of the first surface, and a penetrating hole extending through the substrate between the first surface and the second surface;
forming an electroless plated film on an inner-wall surface of the penetrating hole;
forming a first electrolytic plated film on the electroless plated film such that the first electrolytic plated film forms a first opening portion which opens on the first surface of the substrate, a second opening portion which opens on the second surface of the substrate and a connection portion partitioning the first opening portion and the second opening portion and that the first opening portion and the second opening portion taper toward a central portion of the penetrating hole with respect to an axis direction of the penetrating hole and have cross sections forming a substantially U-shape, respectively;
forming a second electrolytic plated film filling in the first opening portion of the first electrolytic plated film;
and
forming a third electrolytic plated film filling in the second opening portion of the first electrolytic plated film such that a through-hole conductor connecting a first conductive layer on the first surface of the substrate and a second conductive layer on the second surface of the substrate is formed in the penetrating hole of the substrate.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/944,813Filed 12 Nov 2010 · us provisional application
Priority: 20 Nov 2009
Published: US 2011/0120762 A126 May 2011
Granted: 8 Oct 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H05K 3/423
Plated through-holes or plated via connections: characterised by electroplating method
H05K 3/427
Characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern: initial plating of…
H05K 2201/0959
Conductive through-holes or vias: plated through-holes or plated blind vias filled with insulating material
H05K 2203/1476
Related to the order of processing steps: same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning