Mounting structure of electronic component
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
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Abstract
A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one corner of a terminal so that the conductive film makes direct conductive contact with at least part of a top surface of the terminal and at least part of a surface along a thickness direction of the terminal; a substrate having the terminal and the electronic component that is mounted on the substrate; and a holding unit provided to the substrate and the electronic component so as to hold a state in which the bump electrode electrically deformed makes conductive contact with the terminal.
Claims10
An electronic device comprising:
- a substrate having a terminal;
- an electronic component including a bump electrode, the bump electrode comprising:
- a conductive film having contact with the terminal;
- and
- a resin covered by the conductive film;
- and
- an adhesive having contact with the substrate and the electronic component,
- wherein the conductive film contacts with at least part of a top surface of the terminal and at least part of a lateral surface of the terminal.
Dependencies are inferred from the claim text.