US 8,552,308 B2Granted

Differential signal pair transmission structure, wiring board and electronic module

AssigneeVIA Technologies, Inc.

InventorSheng-Yuan Lee

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Abstract

A differential signal pair transmission structure adapted to a wiring board and including a first signal path and a second signal path is provided. The first signal path includes a first upper trace, a first lower trace and a first conductive through via. The second signal path includes a second upper trace, a second lower trace and a second conductive through via. A portion of the first signal path and a portion of the second signal path overlaps in the normal projection onto the upper or lower surface of the wiring board. Normal projections of the first and the second signal path projecting onto the upper surface of the wiring board are substantially symmetric with respect to a line which is perpendicular to a segment connecting normal projections of axes of the first and the second through via onto the upper surface and passes through the midpoint of the segment.

Claims20

Dependent claims

A differential signal pair transmission structure adapted to be disposed on a wiring board and transmit a differential signal pair, the wiring board including a circuit stack and the circuit stack comprising an upper surface and a lower surface opposing the upper surface, the differential signal pair transmission structure comprising:

a first signal path used to transmit one of the differential signal pair, the first signal path comprising:
a first upper trace adapted to be disposed on the upper surface;
a first lower trace adapted to be disposed on the lower surface;
and
a first conductive through via adapted to pass through the circuit stack and extending from the upper surface to the lower surface, and connecting an end of the first upper trace and an end of the first lower trace;
and
a second signal path used to transmit the other of the differential signal pair, the second signal path comprising:
a second upper trace adapted to be disposed on the upper surface;
a second lower trace adapted to be disposed on the lower surface;
and
a second conductive through via adapted to pass through the circuit stack and extending from the upper surface to the lower surface, and connecting an end of the second upper trace and an end of the second lower trace,
wherein a portion of the first signal path and a portion of the second signal path overlap in the normal projection onto the upper surface, and the normal projection of the first signal path and the normal projection of the second signal path projecting onto the upper surface are substantially symmetric with respect to a line which is perpendicular to a segment connecting the normal projection of axis of the first through via and the normal projection of axis of the second through via onto the upper surface and passes through the midpoint of the segment.

9 more elements

A wiring board, comprising:

a circuit stack having an upper surface and a lower surface opposing the upper surface;
and
a differential signal pair transmission structure, comprising:
a first signal path used to transmit one of a differential signal pair, the first signal path comprising:
a first upper trace disposed on the upper surface;
a first lower trace disposed on the lower surface;
and
a first conductive through via passing through the circuit stack and extending from the upper surface to the lower surface, and connecting an end of the first upper trace and an end of the first lower trace;
and
a second signal path used to transmit the other of the differential signal pair, the second signal path comprising:
a second upper trace disposed on the upper surface;
a second lower trace disposed on the lower surface;
and
a second conductive through via passing through the circuit stack and extending from the upper surface to the lower surface, and connecting an end of the second upper trace and an end of the second lower trace,
wherein a portion of the first signal path and a portion of the second signal path overlap in the normal projection onto the upper surface, and the normal projection of the first signal path and the normal projection of the second signal path projecting onto the upper surface are substantially symmetric with respect to a line which is perpendicular to a segment connecting the normal projection of axis of the first through via and the normal projection of axis of the second through via onto the upper surface and passes through the midpoint of the segment.

12 more elements

An electronic module, comprising:

a wiring board, comprising:
a circuit stack having an upper surface and a lower surface opposing the upper surface;
and
a differential signal pair transmission structure, comprising:
a first signal path used to transmit one of a differential signal pair, the first signal path comprising:
a first upper trace disposed on the upper surface;
a first lower trace disposed on the lower surface;
and
a first conductive through via passing through the circuit stack and extending from the upper surface to the lower surface, and connecting an end of the first upper trace and an end of the first lower trace;
and
a second signal path used to transmit the other of the differential signal pair, the second signal path comprising:
a second upper trace disposed on the upper surface;
a second lower trace disposed on the lower surface;
and
a second conductive through via passing through the circuit stack and extending from the upper surface to the lower surface, and connecting an end of the second upper trace and an end of the second lower trace,
wherein a portion of the first signal path and a portion of the second signal path overlap in the normal projection onto the upper surface, and the normal projection of the first signal path and the normal projection of the second signal path projecting onto the upper surface are substantially symmetric with respect to a line which is perpendicular to a segment connecting the normal projection of axis of the first through via and the normal projection of axis of the second through via onto the upper surface and passes through the midpoint of the segment;
an integrated circuit element assembled to the upper surface, and electrically connected to the other end of the first upper trace and the other end of the second upper trace;
and
an electrical connector assembled to the lower surface, and electrically connected to the other end of the first lower trace and the other end of the second lower trace.

16 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/275,320Filed 18 Oct 2011 · us provisional application
Priority: TW 100124049 A7 Jul 2011
Published: US 2012/0243184 A127 Sep 2012
Granted: 8 Oct 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 1/0245
High frequency adaptations: lay-out of balanced signal pairs, e.g. differential lines or twisted lines
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 1/0248
High frequency adaptations: skew reduction or using delay lines
H05K 2201/09618
Conductive through-holes or vias: via fence, i.e. one-dimensional array of vias