Mounting structure

A mounting structure comprising:

• an insulating substrate having a substrate electrode on which at least one space is provided and a resist surrounding the substrate electrode;
• an electronic component having an electronic component electrode to be electrically connected to the substrate electrode;
• and
• solder paste printed on a surface of the substrate electrode, the solder paste being used for soldering the substrate electrode and the electronic component electrode;
• wherein the space has a following relation
• 0<h(μm)≦x(μm)+75(μm)
• where h (μm):width of the space
• x (μm):depth of the space,
• the width of the space is defined as a dimension in a crosswise direction of the space,
• the space is formed from an end of an area of the substrate electrode, the area being located under the electronic component electrode, or from inside of the area of the substrate electrode to a peripheral side of the substrate electrode, and
• the space does not reach a peripheral side of the substrate electrode, the peripheral side being located under the electronic component.