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US 8,552,305 B2Granted
Electronic component-embedded printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Seon Park, Sung Yi, Jung Won Lee
Life of this patent
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Abstract
Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.
Claims6
An electronic component-embedded printed circuit board comprising:
- a base plate including a prepreg having a space for mounting an electronic component, an insulating layer having a resin layer applied on the prepreg and charged in the space, and circuit layers;
- and
- an electronic component mounted in the space,
- wherein the prepreg has a thickness 1.1˜2.5 times greater than that of the electronic component, and the resin layer applied on the prepreg has a thickness 0.2˜2.5 times greater than that of the electronic component to reduce warpage of the printed circuit board, and
- wherein the insulating layer has a thickness 1.2˜2 times greater than that of the prepreg.
2 more elements
Dependencies are inferred from the claim text.