Circuit structure and manufacturing method thereof
AssigneeSubtron Technology Co., Ltd.
InventorChing-Sheng Chen
Life of this patent
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Abstract
A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. The metal layer and the surface passivation layer are dipped into a modifier, and the modifier is selectively absorbed and attached to the surface passivation layer, so as to form a covering layer. The covering layer has a plurality of nanoparticles and covers the surface passivation layer.
Claims8
A circuit structure comprising:
- a metal layer having an upper surface;
- a surface passivation layer configured on the upper surface of the metal layer, the surface passivation layer exposing a portion of the upper surface of the metal layer, a material of the metal layer being different from a material of the surface passivation layer;
- and
- a covering layer configured on the surface passivation layer, the covering layer having a plurality of nanoparticles and covering the surface passivation layer.
Dependencies are inferred from the claim text.