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US 8,552,302 B2Granted
Embedded circuit board and manufacturing method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsKyung-Wan Park, Shi-Yun Cho, Byung-Jik Kim, Ho-Seong Seo, Youn-Ho Choi, Yu-Su Kim, Seok-Myong Kang, Ji-Hyun Jung
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Abstract
An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
Claims7
A embedded circuit board comprising:
- a first copper clad laminate formed with a plurality of cavities with a plurality of chips having different thicknesses embedded in the plurality of cavities;
- a second copper clad laminate provided in the plurality of cavities to allow the first copper clad laminate to level with the plurality of chips;
- and
- a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
1 more element
Dependencies are inferred from the claim text.