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US 8,552,301 B2Granted
Contact equipment and circuit package
AssigneeAdvantest Corporation
InventorTakashi Kusaka
Life of this patent
Estimating the term…
Abstract
A contact device including a contact array, in which contacts are arranged in a grid, and a plurality of differential wire pairs electrically connected to the contact array, wherein each differential wire pair is connected to a contact pair formed by two adjacent contacts in the contact array, and each contact pair is arranged such that a direction of a straight line connecting the two contacts therein is different from a direction of a straight line connecting the two contacts in a contact pair adjacent thereto.
Claims11
A contact device comprising:
- a contact array, in which contacts are arranged in a grid in which the contacts are ositioned at uniform intervals in a row direction and a column direction the contacts including a plurality of contact pairs each of which is formed by two adjacent contacts in the contact array and arranged such that a direction of a straight line connecting the two contacts of the contact pair is different from a direction of a straight line connecting the two contacts of an adjacent contact pair;
- and
- a plurality of differential wire pairs electrically connected to the contact array such that each differential wire pair is connected to one of the plurality of contact pairs.
A circuit package comprising:
- a contact device including a contact array that has contacts arranged in a grid in which the contacts are positioned at uniform intervals in a row direction and a column direction, the contacts including a plurality of contact pairs each of which is formed by two adjacent contacts in the contact array and arranged such that a direction of a straight line connecting the two contacts of the contact pair is different from a direction of a straight line connecting the two contacts of an adjacent contact pair;
- and
- a semiconductor substrate on which a circuit is formed, the circuit electrically connected to the contact device, the semiconductor substrate including a plurality of differential electrode pairs that receive and transfer differential signals, each differential electrode pair connected to one of the plurality of contact pairs.
Dependencies are inferred from the claim text.