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US 8,552,292 B2Granted
System and method for overmolding of decorated plastic parts
AssigneeFlextronics AP, LLC
InventorsJeff Qin, Charles R. Hill, Suriaprakash Narotamo, Levin Li, Spring Wu, Zhong Wang
Life of this patent
Estimating the term…
Abstract
An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
Claims30
An electronic device enclosure comprising:
- a first structural layer having a first surface and a second surface;
- a decorative feature formed on said first surface of said first structural layer;
- and
- a second structural layer formed directly on said first surface of said first structural layer, said second structural layer being formed over said decorative feature by overmolding, wherein said second structural layer is light transmissive.
1 more element
A method for manufacturing an electronic device enclosure, said method comprising:
- providing a first substrate material;
- providing a second substrate material;
- forming said first substrate material into a first structural layer of said device enclosure, said first structural layer having a first surface and an opposite second surface;
- forming a decorative feature on said second surface of said first structural layer of said device enclosure;
- and
- forming a second structural layer of said device enclosure by overmolding said second substrate material on said second surface of said first structural layer of said device enclosure, said second structural layer defining a first exterior surface of said device enclosure, said decorative feature being disposed between said first structural layer of said device enclosure and said second structural layer of said device enclosure.
3 more elements
Dependencies are inferred from the claim text.