# US 8,542,971 B2 · Packages for high power operation of optical fiber components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,542,971 B2 - Document ID: US8542971B2 - Status: Granted - Kind: B2 - Application number: 13/001,335 - Filed: 2009-06-25 - Published: 2011-05-12 - Granted: 2013-09-24 - Earliest claimed: 2008-06-25 - Assignees: Coractive High-Tech Inc. - Applicants: Stéphane Chatigny - Inventors: Stéphane Chatigny - Web page: https://patentgrep.com/patent/US8542971B2 ## CPC - H01S 3/06704: {Housings; Packages} - G02B 6/3636: {the mechanical coupling means being grooves (G02B6/3652 takes precedence)} - G02B 6/0218: {using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients} - G02B 6/14: Mode converters - G02B 6/243: {as light absorbers} - G02B 6/2558: {Reinforcement of splice joint} - G02B 6/4296: {coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources} - H01S 3/042: for solid state lasers {(H01S3/0401 takes precedence)} - Y10T 29/49826: Assembling or joining - Y10T 156/10: Methods of surface bonding and/or assembly therefor - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A package for dissipating heat power and/or optical power from an optical fiber component of a device is provided. The package includes a heat sink packaging receptacle for accommodating the optical fiber component having a cavity for receiving a temperature sensitive portion of the optical fiber component. According to one aspect, the package may include a power-dissipative material for dissipating heat power or optical power, the power-dissipative material extending within the cavity and surrounding the temperature-sensitive portion of the optical fiber component. According to another aspect, the package may include at least one channel extending between the cavity and an end of the heat sink packaging receptacle, the channel being in intimate contact with the cladding of the optical fiber component for dissipating heat power and/or optical power from the optical fiber component. ## Claims ### Claim 1 A package for dissipating at least one of heat power or optical power from a cladding of an optical fiber component of a device, the package comprising: a heat sink packaging receptacle for accommodating the optical fiber component, the heat sink packaging receptacle comprising: a cavity for receiving a temperature sensitive portion of the optical fiber component; a first end for accommodating an input end of the optical fiber component; and a second end for accommodating an output end of the optical fiber component; and a power-dissipative material having heat conducting properties and adapted for dissipating at least one of heat power or optical power from the cladding of the optical fiber component, the power-dissipative material extending within said cavity and surrounding the cladding of the optical fiber component along the temperature-sensitive portion thereof and being in contact with said cladding, said power-dissipative material being in a solid or liquid form. ### Claim 2 (depends on 1) A package according to claim 1, wherein the power-dissipative material comprises optically transparent material having a refractive index conducive to total-internal reflection optical guidance of light within the optical fiber component. ### Claim 3 (depends on 1) A package according to claim 1, wherein the power-dissipative material comprises optically transparent material for mode stripping having a refractive index equal to or greater than a refractive index of the cladding of the temperature-sensitive portion of the optical fiber component. ### Claim 4 (depends on 1) A package according to claim 1, wherein the power-dissipative material has an absorption capacity to absorb light escaping from the optical fiber component. ### Claim 5 (depends on 1) A package according to claim 1, wherein the power-dissipative material comprises gallium. ### Claim 6 (depends on 1) A package according to claim 1, wherein the power-dissipative material comprises a metal or metallic alloy. ### Claim 7 (depends on 1) A package according to claim 1, wherein the power-dissipative material is selected from the group comprising metals, metallic alloys, composites, low index polymers and epoxies. ### Claim 8 (depends on 1) A package according to claim 1, wherein the heat sink packaging receptacle further comprises at least one channel extending between the cavity and either the first end or the second end of the heat sink packaging receptacle, the channel being in intimate contact with a cladding of the optical fiber component for dissipating at least one of heat power or optical power from the optical fiber component. ### Claim 9 (depends on 1) A package according to claim 1, wherein the heat sink packaging receptacle further comprises: an entry channel extending between the first end and the cavity, the entry channel being in intimate contact with the input end of the optical fiber component for dissipating at least one of heat power or optical power from the input end of the optical fiber component; and an exit channel extending between the second end and the cavity, the exit channel being in intimate contact with the output end of the optical fiber component for dissipating at least one of heat power or optical power from the output end of the optical fiber component. ### Claim 10 (depends on 1) A package according to claim 1, further comprising an adhesive proximate each of the first end and the second end of the heat sink packaging receptacle for affixing the optical fiber component to the heat sink packaging receptacle. ### Claim 11 (depends on 10) A package according to claim 10, wherein the adhesive is optically transparent and temperature resistant. ### Claim 12 (depends on 1) A package according to claim 1, wherein the heat sink packaging receptacle comprises a heat sink substrate and a heat sink cover engaged in substantially mating relation to define the cavity. ### Claim 13 (depends on 12) A package according to claim 12, wherein the heat sink substrate and heat sink cover consist of a heat conductive metal or metallic alloy. ### Claim 14 (depends on 13) A package according to claim 13, wherein the heat conductive metal or metallic alloy comprises aluminum or copper. ### Claim 15 A package for dissipating at least one of heat power or optical power from an optical fiber component of a device, the optical fiber component having a light-guiding core and a cladding surrounding the core, the package comprising: a heat sink packaging receptacle for accommodating the optical fiber component, the heat sink packaging receptacle comprising: a cavity for receiving a temperature-sensitive portion of the optical fiber component; a first end for accommodating an input end of the optical fiber component; a second end for accommodating an output end of the optical fiber component; and at least one channel extending between the cavity and any one of the first end and the second end, the channel being in intimate contact with the cladding of the optical fiber component for dissipating at least one of heat power or optical power from the corresponding one of the input end and output end of the optical fiber component. ### Claim 16 (depends on 15) A package according to claim 15, further comprising an adhesive for affixing the optical fiber component to the heat sink packaging receptacle, the adhesive placed at an adhesive bond site that is located within the at least one channel and distally to the cavity. ### Claim 17 (depends on 15) A package according to claim 15, wherein the at least one channel comprises an entry channel extending between the first end and the cavity, and an exit channel extending between the second end and the cavity. ### Claim 18 (depends on 17) A package according to claim 17, further comprising an adhesive for affixing the optical fiber component to the heat sink packaging receptacle, the adhesive placed at adhesive bond sites that are located within the entry channel and the exit channel respectively, distally to the cavity. ### Claim 19 (depends on 16, 18) A package according to claim 16 or claim 18, wherein the adhesive is optically transparent and temperature resistant. ### Claim 20 (depends on 16, 18) A package according to claim 16 or claim 18, wherein the adhesive has a refractive index greater than a refractive index of the cladding of the optical fiber component. ### Claim 21 (depends on 15) A package according to claim 15, wherein the cavity comprises heat-insensitive gas surrounding the temperature-sensitive portion of the optical fiber component. ### Claim 22 (depends on 21) A package according to claim 21, wherein the heat-insensitive gas surrounding the temperature-sensitive portion of the optical fiber component is air or an inert gas. ### Claim 23 (depends on 15) A package according to claim 15, wherein the cavity contains a power-dissipative material for dissipating at least one of heat power or optical power, the power-dissipative material surrounding the temperature sensitive portion of the optical fiber component. ### Claim 24 (depends on 15) A package according to claim 15, wherein the heat sink packaging receptacle comprises a heat sink substrate and a heat sink cover engaged in substantially mating relation to define the cavity. ### Claim 25 (depends on 24) A package according to claim 24, wherein the heat sink substrate and heat sink cover consist of heat conductive metallic material. ### Claim 26 A method of packaging a high-power optical fiber component of a device, the method comprising the steps of: inserting the optical fiber component into a heat sink substrate having a cavity for receiving a temperature sensitive portion of the optical fiber component; introducing a power-dissipative material inside the cavity, the power-dissipative material having heat conducting properties and extending within the cavity so as to contact and surround the temperature sensitive portion of the optical fiber component for dissipating at least one of heat power or optical power from a cladding of said optical fiber component, said power-dissipative material being in a solid or liquid form; and placing a heat sink cover in substantially mating relation with the heat sink substrate thereby enclosing the optical fiber component and packaging the optical fiber component. ### Claim 27 (depends on 26) A method of packaging according to claim 26, further comprising the step of fixing the optical fiber component to the heat sink substrate using adhesive at an adhesive bond site proximate an end of the heat sink substrate. ### Claim 28 (depends on 26) A method of packaging according to claim 26, wherein the step of inserting the optical fiber component further comprises inserting an end portion of the optical fiber component within a channel that extends between the cavity and an end of the heat sink substrate, the end portion being put in intimate contact with the channel. ### Claim 29 (depends on 28) A method of packaging according to claim 28, further comprising the step of fixing the optical fiber component to the heat sink substrate using adhesive at an adhesive bond site that is located within the channel distally to the cavity. ### Claim 30 (depends on 27, 29) A method of packaging according to claim 27 or claim 29, wherein the adhesive is optically transparent and temperature resistant. ### Claim 31 (depends on 26) A method of packaging according to claim 26, wherein the step of introducing a power-dissipative material inside the cavity comprises liquid filling the power-dissipative material into the cavity and solidifying in place the power-dissipative material. ### Claim 32 (depends on 26) A method of packaging according to claim 26, further comprising a step, before the step of inserting the optical fiber component, of recoating a previously uncoated section of the temperature-sensitive portion of the optical fiber component. ### Claim 33 A method of packaging a high-power optical fiber component of a device, the optical fiber component having a light-guiding core and a cladding surrounding the core, the method comprising the steps of: inserting the optical fiber component into a heat sink substrate having a cavity for receiving a temperature-sensitive portion of the optical fiber component and having at least one channel that extends between the cavity and an end of the heat sink substrate for receiving an end portion of the optical fiber component, the end portion being put in intimate contact with the at least one channel so as to dissipate at least one of heat power or optical power from the corresponding one of the input end and output end of the optical fiber component; and placing a heat sink cover in substantially mating relation with the heat sink substrate thereby enclosing the optical fiber component and packaging the optical fiber component. ### Claim 34 (depends on 33) A method of packaging according to claim 33, wherein the step of inserting the optical fiber component comprises positioning the optical fiber component such that the cladding of the optical fiber component does not extend into the cavity. ### Claim 35 (depends on 33) A method of packaging according to claim 33, further comprising the step of fixing the optical fiber component to the heat sink substrate using adhesive at an adhesive bond site that is located within the channel distal to the cavity. ### Claim 36 (depends on 33) A method of packaging according to claim 33, further comprising the step of introducing a heat-insensitive gas into the cavity. ### Claim 37 (depends on 33) A method of packaging according to claim 33, further comprising the step of introducing a power-dissipative material into the cavity, the power-dissipative material extending within the cavity and surrounding the temperature sensitive portion of the optical fiber component. ### Claim 38 (depends on 37) A method of packaging according to claim 37, wherein the step of introducing a power-dissipative material inside the cavity comprises liquid filling the power-dissipative material into the cavity and solidifying in place the power-dissipative material. ### Claim 39 (depends on 33) A method of packaging according to claim 33, further comprising a step, before the step of inserting the optical fiber component, of recoating a previously uncoated section of the temperature-sensitive portion of the optical fiber component.