# US 8,542,494 B2 · Circuit board having holes to increase resonant frequency of via stubs > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,542,494 B2 - Document ID: US8542494B2 - Status: Granted - Kind: B2 - Application number: 12/770,691 - Filed: 2010-04-29 - Published: 2011-11-03 - Granted: 2013-09-24 - Earliest claimed: 2010-04-29 - Assignees: International Business Machines Corporation - Applicants: Bhyrav M. Mutnury; Nam H. Pham; Terence Rodrigues - Inventors: Bhyrav M. Mutnury; Nam H. Pham; Terence Rodrigues - Web page: https://patentgrep.com/patent/US8542494B2 ## CPC - H05K 3/42: Plated through-holes {or plated via connections} - H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line} - H05K 1/0251: {related to vias or transitions between vias and transmission lines} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 2201/0792: Means against parasitic impedance; Means against eddy currents - H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal. ## Claims ### Claim 1 A circuit board comprising: a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer; a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs; a first pair of conductive signal paths connected to the pair of vias within the first layer; a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias; and, one or more holes extending at least partially through the layers and located between the pair of vias, the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal. ### Claim 2 (depends on 1) The circuit board of claim 1, wherein the holes extend completely through the layers. ### Claim 3 (depends on 1) The circuit board of claim 1, wherein the holes are not filled with any material, such that ambient air is located within the holes. ### Claim 4 (depends on 1) The circuit board of claim 1, wherein the holes each have a radius smaller than a radius of each via. ### Claim 5 (depends on 1) The circuit board of claim 1, wherein the holes are positioned along a line between center points of the pair of vias. ### Claim 6 (depends on 1) The circuit board of claim 1, wherein the holes comprise: a plurality of first holes positioned along a first curve around a first via of the pair of vias; and, a plurality of second holes positioned along a second curve around a second via of the pair of vias. ### Claim 7 (depends on 1) The circuit board of claim 1, wherein each via stub is a transmission line antenna having the resonant frequency. ### Claim 8 (depends on 1) The circuit board of claim 1, further comprising: a pair of anti-pads concentric to the pair of vias and extending through the layers; a first pair of pads on the first layer and concentric to and in contact with the pair of vias, the first pair of pads connecting the first pair of conductive signal paths to the pair of vias, the first pair of conductive signal paths crossing the pair of anti-pads; and, a second pair of pads on the second layer and concentric to and in contact with the pair of vias, the second pair of pads connecting the second pair of conductive signal paths to the pair of vias, the first pair of conductive signal paths crossing the pair of anti-pads, wherein each pad has a radius smaller than a radius of each anti-pad. ### Claim 9 (depends on 1) The circuit board of claim 1, wherein the plurality of layers comprise a plurality of signal layers and a plurality of power/ground layers, the signal layers interleaved in relation to the power/ground layers such that no two signal layers are immediately adjacent to one another and no two power/ground layers are immediately adjacent to one another, wherein the first layer and the second layer are each one of the signal layers, and wherein each power/ground layer is one of a ground layer and a power layer. ### Claim 10 An electronic device comprising: one or more electrical components; and, a circuit board on, to, or within which each electrical component is mounted, wherein the circuit board comprises: a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer; a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs; a first pair of conductive signal paths connected to the pair of vias within the first layer; a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias; and, one or more holes extending at least partially through the layers and located between the pair of vias, the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal. ### Claim 11 A circuit board comprising: a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer; a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs; a first pair of conductive signal paths connected to the pair of vias within the first layer; a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias, means for increasing a resonant frequency of the pair of via stubs beyond the frequency of the differential signal without backdrilling one or more of the pair of vias. ### Claim 12 (depends on 11) The circuit board of claim 11, wherein the means comprises one or more holes extending at least partially through the layers and located between the pair of vias, the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal. ### Claim 13 A circuit board comprising: a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer; a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs; a first pair of conductive signal paths connected to the pair of vias within the first layer; a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias; and, one or more holes extending at least partially through the layers and located between the air of vias the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal, wherein the holes having the lower dielectric constant than the layers increase the resonant frequency of the pair of via stubs beyond the frequency of the differential signal without having to backdrill one or more of the pair of vias. ### Claim 14 An electronic device comprising: one or more electrical components; and, a circuit board on, to, or within which each electrical component is mounted, wherein the circuit board comprises: a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer; a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs; a first pair of conductive signal paths connected to the pair of vias within the first layer; a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias; and, one or more holes extending at least partially through the layers and located between the pair of vias the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal, wherein the holes having the lower dielectric constant than the layers increase the resonant frequency of the pair of via stubs beyond the frequency of the differential signal without having to backdrill one or more of the pair of vias.