# US 8,542,477 B2 · Multilayer ceramic electronic part

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- Number: US 8,542,477 B2
- Document ID: US8542477B2
- Status: Granted
- Kind: B2
- Application number: 13/404,890
- Filed: 2012-02-24
- Published: 2013-05-30
- Granted: 2013-09-24
- Earliest claimed: 2011-11-25
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Wi Heon Kim; Doo Young Kim; Jin Man Jung
- Inventors: Wi Heon Kim; Doo Young Kim; Jin Man Jung
- Web page: https://patentgrep.com/patent/US8542477B2

## CPC

- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- Y10T 29/435: Solid dielectric type
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

There is provided a multilayer ceramic electronic part, including: a ceramic body including dielectric layers each having an average thickness of 0.6 μm or less; and first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween, wherein the ceramic body includes a capacitance forming part and non-capacitance forming parts, and when the capacitance forming part is divided into 2n+1 (n is 1 or more) regions in a thickness direction of the ceramic body, the dielectric layers of the capacitance forming part get thinner in directions from a central region toward upper and lower regions, whereby continuity of the internal electrode may be improved and a high-capacity multilayer ceramic electronic part may be realized.

## Claims

### Claim 1

A multilayer ceramic electronic part, comprising:
a ceramic body including dielectric layers each having an average thickness of 0.6 μm or less; and
first and second internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween,
the ceramic body including a capacitance forming part contributing to capacitance formation and a non-capacitance forming part provided on at least one of upper and lower surfaces of the capacitance forming part, and the dielectric layers of the capacitance forming part being provided to get thinner in directions from a central region toward an upper region and from the central region toward a lower region when the capacitance forming part is divided into 2n+1 (n is 1 or more) regions in a thickness direction of the ceramic body.

### Claim 2 (depends on 1)

The multilayer ceramic electronic part of claim 1, wherein the upper and lower regions each have a thickness satisfying 1 to 20% based on the overall thickness of the capacitance forming part in a thickness direction of the ceramic body.

### Claim 3 (depends on 1)

The multilayer ceramic electronic part of claim 1, wherein when the capacitance forming part is divided into 3 regions, the central region is thicker by 1 to 20% than the upper and lower regions.

### Claim 4 (depends on 1)

The multilayer ceramic electronic part of claim 1, wherein the first and second internal electrodes each have an average thickness of 0.6 μm or less.

### Claim 5 (depends on 1)

The multilayer ceramic electronic part of claim 1, wherein the first or second internal electrode has a continuity of 90% or more.

### Claim 6

A method of manufacturing a multilayer ceramic electronic part, comprising:
preparing ceramic green sheets by using a slurry including ceramic powder;
forming internal electrode patterns on the ceramic green sheets respectively, by using a conductive metal paste; and
laminating and sintering the ceramic resultant green sheets, to form a ceramic body including dielectric layers, and first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween,
the ceramic body including a capacitance forming part contributing to capacitance formation and non-capacitance forming parts provided on at least one of upper and lower surfaces of the capacitance forming part, and the dielectric layers of the capacitance forming part getting thinner in directions from a central region toward an upper region and from the central region toward a lower region when the capacitance forming part is divided into 2n+1 (n is 1 or more) regions in a thickness direction of the ceramic body.

### Claim 7 (depends on 6)

The method of claim 6, wherein the upper and lower regions each have a thickness satisfying 1 to 20% based on the overall thickness of the capacitance forming part in the thickness direction of the ceramic body.

### Claim 8 (depends on 6)

The method of claim 6, wherein, when the capacitance forming part is divided into 3 regions in the thickness direction of the ceramic body, the central region is thicker than the upper and lower regions by 1 to 20%.

### Claim 9 (depends on 6)

The method of claim 6, wherein the first and second internal electrodes each have an average thickness of 0.6 μm or less.

### Claim 10 (depends on 6)

The method of claim 6, wherein the first or second internal electrode has a continuity of 90% or more.

### Claim 11 (depends on 6)

The method of claim 6, wherein the number of laminations of the ceramic green sheets is 400 or more.

### Claim 12 (depends on 6)

The method of claim 6, wherein the conductive metal paste includes 40 to 50 parts by weight of metal powder.

### Claim 13 (depends on 6)

The method of claim 6, wherein a metal for the metal powder is at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), and palladium-silver (Pd—Ag) alloy.