# US 8,542,474 B2 · Electrostatic chuck

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- Number: US 8,542,474 B2
- Document ID: US8542474B2
- Status: Granted
- Kind: B2
- Application number: 12/910,414
- Filed: 2010-10-22
- Published: 2011-04-28
- Granted: 2013-09-24
- Earliest claimed: 2009-10-26
- Assignees: Shinko Electric Industries Co., Ltd.
- Applicants: Hiroshi Yonekura; Akihiro Kuribayashi; Kazuyuki Ogura; Hidehiro Komatsu
- Inventors: Hiroshi Yonekura; Akihiro Kuribayashi; Kazuyuki Ogura; Hidehiro Komatsu
- Web page: https://patentgrep.com/patent/US8542474B2

## CPC

- H10P 72/722: {Details of electrostatic chucks}
- Y10T 279/23: with magnetic or electrostatic means
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An electrostatic chuck has a structure in which a heater is sandwiched between a base member and an electrostatic chuck substrate, the heater being bonded to the base member with an adhesive layer interposing therebetween. The adhesive layer interposing between the heater and the base member has a structure in which a first adhesive layer and a second adhesive layer are stacked, the first adhesive layer being formed by curing an adhesive having high thermal conductivity, the second adhesive layer being formed as gel by curing an adhesive having lower viscosity than the adhesive of the first adhesive layer. Preferably, the first and second adhesive layers are both made of a silicone-based resin.

## Claims

### Claim 1

An electrostatic chuck comprising:
a metallic base member;
an electrostatic chuck substrate; and
a heater provided between the base member and the electrostatic chuck substrate and bonded to the base member with an adhesive layer interposing therebetween,
wherein the adhesive layer, having a thickness of 0.5 to 2 mm, has a structure in which a first adhesive layer and a second adhesive layer are stacked, the first adhesive layer being formed by curing an adhesive of a silicone-based resin having high thermal conductivity, the second adhesive layer being formed as a silicone gel, having a thickness of 0.05 to 0.3 mm, by curing an adhesive having lower viscosity than the adhesive of the first adhesive layer.

### Claim 2 (depends on 1)

The electrostatic chuck according to claim 1, wherein the first adhesive layer is bonded to the heater, and the second adhesive layer is bonded to the base member.

### Claim 3 (depends on 1)

The electrostatic chuck according to claim 1, wherein the first adhesive layer is bonded to the base member, and the second adhesive layer is bonded to the heater.

### Claim 4 (depends on 1)

The electrostatic chuck according to claim 1, wherein the adhesive layer has a structure in which the second adhesive layer is sandwiched between the first adhesive layer bonded to the heater and the first adhesive layer bonded to the base member.