# US 8,541,884 B2 · Through-substrate via having a strip-shaped through-hole signal conductor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,884 B2 - Document ID: US8541884B2 - Status: Granted - Kind: B2 - Application number: 13/535,377 - Filed: 2012-06-28 - Published: 2013-01-10 - Granted: 2013-09-24 - Earliest claimed: 2011-07-06 - Assignees: Research Triangle Institute - Applicants: Robert O. Conn; David F. Myers; Daniel S. Stevenson - Inventors: Robert O. Conn; David F. Myers; Daniel S. Stevenson - Web page: https://patentgrep.com/patent/US8541884B2 ## CPC - H10W 20/023: {the interconnections being through-semiconductor vias} - H10W 20/0261: {characterised by the filling method or the material of the conductive fill} - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 20/2128: {Coaxial through-semiconductor vias} - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 70/685: comprising multiple insulating layers - H10W 70/686: {the multiple insulating layers having different compositions, e.g. polymer layer on glass substrate} - H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon - H10W 70/63: Vias, e.g. via plugs - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A TSV structure suitable for high speed signal transmission includes a metal strip portion that extends through a long and small diameter hole in a substrate. In one example, the metal strip portion is formed by laser ablating away portions of a metal sheath that lines a cylindrical sidewall of the hole, thereby leaving a longitudinal section of metal that is the metal strip portion. A second metal strip portion, that extends in a direction perpendicular to the hole axis, is contiguous with the metal strip portion that extends through the hole such that the two metal strip portions together form a single metal strip. Throughout its length, the single metal strip has a uniform width and thickness and therefore can have a controlled and uniform impedance. In some embodiments, multiple metal strips pass through the same TSV hole. In some embodiments, the structure is a coaxial TSV. ## Claims ### Claim 1 A structure comprising: a substrate layer comprising a layer of monocrystalline semiconductor material, wherein the substrate layer forms a hole, wherein the hole extends through the layer of monocrystalline semiconductor material, wherein the hole has an axis and a width, wherein the width of the hole is less than one hundred microns; and a metal strip that has a substantially uniform width and that extends a first distance in a direction substantially perpendicular to the axis of the hole and that then turns and extends a second distance in a direction substantially parallel to the axis along a portion of a sidewall of the hole, wherein the width of the metal strip is less than the width of the hole, and wherein second distance is at least seventy-five microns. ### Claim 2 (depends on 1) The structure of claim 1, wherein the hole has a circular cross section, wherein the sidewall of the hole has a substantially cylindrical shape, and wherein a center portion of the circular cross section of the hole is devoid of metal. ### Claim 3 (depends on 1) The structure of claim 1, wherein the metal strip has a substantially uniform thickness as it extends the first distance in the direction substantially perpendicular to the axis of the hole and then as it extends the second distance along the portion of the sidewall of the hole. ### Claim 4 (depends on 1) The structure of claim 1, wherein the sidewall of the hole is a surface of an insulating layer, wherein the insulating layer has a tubular shape, and wherein the metal strip extends along an inside sidewall surface of the tubular shaped insulating layer. ### Claim 5 (depends on 1) The structure of claim 1, further comprising: a metal layer that covers substantially all of the sidewall of the hole except for 1) a portion of the sidewall along which the metal strip extends, 2) a first narrow strip of the sidewall that extends along a first edge of the metal strip, and 3) a second narrow strip of the sidewall that extends along a second edge of the metal strip. ### Claim 6 (depends on 1) The structure of claim 1, wherein the metal strip extends out of the hole and turns and extends a third distance in a direction substantially perpendicular to the axis of the hole, wherein the metal strip has the substantially uniform width as it extends out of the hole and as it extends the third distance. ### Claim 7 (depends on 1) The structure of claim 1, further comprising: a plurality of bond pads; and a plurality of integrated circuit dice that are die bonded to the bond pads. ### Claim 8 (depends on 7) The structure of claim 7, wherein the structure comprises an interconnect layer portion disposed on the substrate layer, and wherein the first distance of the metal strip is part of the interconnect layer portion. ### Claim 9 (depends on 8) The structure of claim 8, wherein the structure is taken from the group consisting of: an interposer inside an integrated circuit package, and Silicon Circuit Board (SiCB). ### Claim 10 (depends on 1) The structure of claim 1, wherein the sidewall of the hole is sheathed with a layer of metal but for two narrow strip portions of the sidewall, wherein a first of the two narrow strip portions extends along a first edge of the metal strip, and wherein a second of the two narrow strip portions extends along a second edge of the metal strip. ### Claim 11 (depends on 1) The structure of claim 1, further comprising: a second metal strip that has the substantially uniform width and that extends a distance in a direction substantially perpendicular to the axis of the hole and that then turns and extends the second distance along the sidewall of the hole, wherein the width of the second metal strip is less than the width of the hole, and wherein the second distance is at least seventy-five microns. ### Claim 12 (depends on 1) The structure of claim 1, wherein the hole is a substantially tubular channel having a ledge that protrudes into a center portion of the substantially tubular channel, wherein the ledge has a surface that extends lengthwise along the center portion of the substantially tubular channel, and wherein the portion of the sidewall along which the metal strip extends is the surface of the ledge. ### Claim 13 (depends on 12) The structure of claim 12, wherein the sidewall of the hole in cross-section defines a circular arc of more than one hundred and eighty degrees, wherein the circular arc is covered with a layer of metal, and wherein the layer of metal that covers the circular arc is not in electrical contact with the metal strip that extends along the surface of the ledge. ### Claim 14 A method comprising: (a) using a laser to remove two parallel extending strips of a tubular sheath of metal and thereby forming a first strip portion of metal, wherein the tubular sheath prior to said removal sheaths a sidewall of a hole, wherein the hole is a hole in a substrate layer, wherein the hole has an axis and a width and extends through a layer of monocrystalline semiconductor material of the substrate layer, wherein the width of the hole is less than one hundred microns, wherein the two parallel strips of metal that are removed extend parallel to the axis of the hole for a distance of at least seventy-five microns, and wherein the removing of the two parallel strips leaves the first strip portion of metal so that the first strip portion extends along the sidewall for a distance of at least seventy-five microns; and (b) providing a second strip portion of metal that extends in a plane, wherein the plane is substantially perpendicular to the axis of the hole, wherein the first strip portion and the second strip portion together form a single strip of metal of substantially uniform width that extends a first distance in the plane and then turns approximately ninety degrees and extends along the sidewall of the hole. ### Claim 15 (depends on 14) The method of claim 14, wherein the second strip portion has a width, and wherein the single strip of metal at no point has a width greater than the width of the second strip portion. ### Claim 16 (depends on 14) The method of claim 14, wherein the second strip portion is provided in (b) before the first strip portion is formed in (a). ### Claim 17 (depends on 14) The method of claim 14, wherein the second strip portion is provided in (b) after the first strip portion is formed in (a). ### Claim 18 (depends on 14) The method of claim 14, wherein the second strip portion is formed by laser ablation. ### Claim 19 (depends on 14) The method of claim 14, wherein the laser removes the two parallel extending strips in (a) by laser ablation. ### Claim 20 (depends on 14) The method of claim 14, wherein the second strip portion has a thickness, wherein the tubular sheath has a thickness, and wherein the thickness of the second strip portion and the thickness of the tubular sheath are substantially identical. ### Claim 21 (depends on 14) The method of claim 14, further comprising: forming a bond pad that is electrically connected to the first strip portion of metal. ### Claim 22 A method comprising: forming a metal strip that extends a first distance in a plane substantially perpendicular to an axis of a hole and that then turns approximately ninety degrees and extends a second distance along a portion of a sidewall of the hole, wherein the hole has a width that is less than one hundred microns, wherein second distance is at least seventy-five microns, wherein the metal strip has a substantially uniform width that is substantially less than the width of the hole, and wherein a center portion of the hole is devoid of metal. ### Claim 23 (depends on 22) The method of claim 22, wherein the forming of the metal strip involves laser ablation of an amount of metal from within the hole, and wherein a portion of the metal strip that extends the second distance is a longitudinal slice of a tubular sheath of metal. ### Claim 24 A structure comprising: a semiconductor substrate having a first major planar surface and a second major planar surface, wherein the semiconductor substrate forms a hole, wherein the hole extends from the first major planar surface and through the semiconductor substrate and to the second major planar surface, wherein the hole has a maximum width of less than one hundred microns; a first metal strip portion that extends through the hole for a distance of more than seventy-five microns, wherein the first metal strip portion has a uniform width within the hole, and wherein the width is substantially less than the maximum width of the hole; and a second metal strip portion that extends in a direction parallel to the first major planar surface of the semiconductor substrate, wherein the second metal strip portion has the same uniform width as the first metal strip portion, and wherein the first and second metal strip portions together form a contiguous metal strip having the uniform width.