# US 8,541,809 B2 · Light-emitting surface element and method for producing a light-emitting surface element

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- Number: US 8,541,809 B2
- Document ID: US8541809B2
- Status: Granted
- Kind: B2
- Application number: 12/679,774
- Filed: 2008-09-26
- Published: 2010-08-05
- Granted: 2013-09-24
- Earliest claimed: 2007-09-28
- Assignees: OSRAM Opto Semiconductors GmbH
- Applicants: Jorg E. Sorg; Stefan Gruber
- Inventors: Jorg E. Sorg; Stefan Gruber
- Web page: https://patentgrep.com/patent/US8541809B2

## CPC

- G02B 6/0073: {Light emitting diode [LED]}
- G02B 6/0065: {Manufacturing aspects; Material aspects}
- G02B 6/0021: {for housing at least a part of the light source, e.g. by forming holes or recesses}
- G02B 6/0083: {Details of electrical connections of light sources to drivers, circuit boards, or the like}
- G02B 6/0091: {of the light source relative to the light guide (G02B6/0021 takes precedence)}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light-emitting surface element includes a connection device, a light-generating element having at least two electrical connections electrically conductively connected to assigned connection lines on the connection device, and at least one planar light-guiding element formed by injection-molding in a manner at least partly embedding an arrangement composed of connection device and light-generating element in the planar light-guiding element.

## Claims

### Claim 1

A light-emitting surface element comprising:
a connection device formed from a strip material and connection lines arranged on the strip material and has openings at regular distances along a longitudinal extent, through which openings the planar light-guiding surface element projects integrally;
a light-generating element comprising a light-emitting diode formed as a chip size package and having at least two connections electrically conductively connected to assigned connection lines on the connection device; and
at least one planar light-guiding element formed by injection-molding in a manner at least partly embedding an arrangement composed of connection device and light-generating element in the planar light-guiding element, wherein light from the light-generating element propagates along the planar light-guiding element in a direction perpendicular to the strip material.

### Claim 2 (depends on 1)

The light-emitting surface element as claimed in claim 1, wherein the chip size package has a carrier with connection elements and lying on the carrier a light-emitting diode chip electrically conductively connected to the connection elements.

### Claim 3 (depends on 1)

The light-emitting surface element as claimed in claim 1, wherein a light-emitting region of the light-generating element is covered by a converter that converts the light emitted with a first wavelength by the light-generating element into a light having a wavelength different therefrom.

### Claim 4 (depends on 3)

The light-emitting surface element as claimed in claim 3, wherein the converter is formed as a layer covering the light-emitting region on the chip.

### Claim 5 (depends on 3)

The light-emitting surface element as claimed in claim 3, wherein the converter is formed in a manner covering the chip size package on the carrier.

### Claim 6 (depends on 1)

The light-emitting surface element as claimed in claim 1, wherein a plurality of light-generating elements are provided on the connection device.

### Claim 7 (depends on 2)

The light-emitting surface element as claimed in claim 2, wherein a light-emitting region of the light-generating element is covered by a converter that converts the light emitted with a first wavelength by the light-generating element into a light having a wavelength different therefrom.

### Claim 8

A method for producing a light-emitting surface element comprising:
providing a connection device;
arranging a light-generating element on the connection device; and
producing a planar light-guiding element by injection-molding in such a way that the light-generating element and the connection device are at least partly embedded into the light-guiding element, wherein the planar light-guiding element projects vertically with respect to the surface of the connection device and in the propagating direction of generated light.

### Claim 9 (depends on 8)

The method as claimed in claim 8, wherein the connection device is provided as a continuous material, and the individual light-emitting surface element is separated after curing of the injection-molded planar light-guiding elements.