# US 8,541,805 B2 · Mounting substrate and manufacturing method thereof, light-emitting module and illumination device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,805 B2 - Document ID: US8541805B2 - Status: Granted - Kind: B2 - Application number: 13/582,330 - Filed: 2011-04-27 - Published: 2012-12-20 - Granted: 2013-09-24 - Earliest claimed: 2010-05-13 - Assignees: Panasonic Corporation - Applicants: Atsushi Motoya; Kazuyuki Okano; Minako Akai; Yurika Goto; Naoki Tagami; Makoto Horiuchi; Toshio Mori; Takaari Uemoto; Masahiro Miki - Inventors: Atsushi Motoya; Kazuyuki Okano; Minako Akai; Yurika Goto; Naoki Tagami; Makoto Horiuchi; Toshio Mori; Takaari Uemoto; Masahiro Miki - Web page: https://patentgrep.com/patent/US8541805B2 ## CPC - H10W 90/00: Package configurations - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - F21K 9/23: Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings - F21V 3/00: Globes; Bowls; Cover glasses (with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506) - F21V 7/22: characterised by materials, surface treatments or coatings, e.g. dichroic reflectors - F21Y 2115/10: Light-emitting diodes [LED] - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/017: Glass ceramic coating, e.g. formed on inorganic substrate - H05K 2201/09154: Bevelled, chamferred or tapered edge - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics - H10H 20/851: Wavelength conversion means - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/5522: {comprising gold [Au]} - H10W 90/753: {between laterally-adjacent chips} - Y10T 428/263: Coating layer not in excess of 5 mils thick or equivalent - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips. ## Claims ### Claim 1 A mounting substrate on which a semiconductor light-emitting element is to be mounted, the mounting substrate comprising: a substrate that has a front surface on which the semiconductor light-emitting element is to be mounted and transmits light from the semiconductor light-emitting element; a wiring pattern on the front surface of the substrate; and a first reflective film on a back surface of the substrate, wherein the first reflective film is a multilayer film, the multilayer film includes a first film and a second film, the first film reflecting the light, which is emitted from the semiconductor light-emitting element and is transmitted through the substrate, toward the front surface of the substrate and the second film being on the first film on an opposite side to the substrate, the first film includes metal oxide microparticles that reflect the light from the semiconductor light-emitting element and a first glass frit, the second film includes a second glass frit, and a second volume concentration of the second glass frit in the second film is larger than a first volume concentration of the first glass frit in the first film. ### Claim 2 (depends on 1) The mounting substrate according to claim 1, wherein the first reflective film has a thickness in a range of 10 μm to 100 μm. ### Claim 3 (depends on 1) The mounting substrate according to claim 1, wherein the substrate has a transmittance for the light from the semiconductor light-emitting element of at least 1%. ### Claim 4 (depends on 1) The mounting substrate according to claim 1, further comprising: a second reflective film on an end surface of the substrate, the second reflective film reflecting the light, which is emitted from the semiconductor light-emitting element and is transmitted through the substrate, toward the front surface of the substrate, wherein the second reflective film includes the metal oxide microparticles and the first glass frit. ### Claim 5 (depends on 4) The mounting substrate according to claim 4, wherein the substrate includes an inclined surface on the end surface, the inclined surface being inclined so as to expand from the back surface toward the front surface. ### Claim 6 (depends on 1) The mounting substrate according to claim 1, wherein the substrate has irregularities on the front surface except for regions where the semiconductor light-emitting element is to be mounted and where an electrode is disposed. ### Claim 7 (depends on 1) The mounting substrate according to claim 1, wherein the first reflective film is on an entirety of the back surface of the substrate. ### Claim 8 (depends on 1) The mounting substrate according to claim 1, wherein the substrate is one of a resin substrate, a glass substrate, and a ceramic substrate. ### Claim 9 (depends on 1) The mounting substrate according to claim 1, wherein the second film further includes the metal oxide microparticles, and the second volume concentration of the second glass frit in the second film is at least 20%. ### Claim 10 (depends on 1) The mounting substrate according to claim 1, wherein the first volume concentration of the first glass frit in the first film is less than 20%. ### Claim 11 (depends on 1) The mounting substrate according to claim 1, wherein the second film consists of only the second glass frit. ### Claim 12 (depends on 1) The mounting substrate according to claim 1, wherein the multilayer film further includes a third film consisting of only a third glass frit, and the third film is between the substrate and the first film. ### Claim 13 (depends on 1) The mounting substrate according to claim 1, wherein the multilayer film further includes a third film consisting of only a third glass frit, and the third film is on an opposite side of the second film to the first film. ### Claim 14 (depends on 1) The mounting substrate according to claim 1, wherein the front surface of the substrate includes a plated electrode. ### Claim 15 (depends on 1) The mounting substrate according to claim 1, wherein the first glass frit includes SiO2-B2O3-R2O, and R2O is one of Li2O, Na2O, and K2O. ### Claim 16 (depends on 1) The mounting substrate according to claim 1, wherein the substrate is a ceramic substrate. ### Claim 17 (depends on 1) The mounting substrate according to claim 1, wherein the metal oxide microparticles include one of titanium oxide, aluminum oxide, zinc oxide, zirconium oxide, and magnesium oxide. ### Claim 18 A manufacturing method of a mounting substrate on which a semiconductor light-emitting element is to be mounted, the method comprising: forming a reflective film on a back surface of a substrate that includes a front surface on which the semiconductor light-emitting element is to be mounted and transmits light from the semiconductor light-emitting element; and forming an electrode on the front surface of the substrate, wherein the forming of the reflective film includes: forming a first film that includes metal oxide microparticles and a glass frit and reflects the light, which is emitted from the semiconductor light-emitting element and is transmitted through the substrate, toward the front surface of the substrate, by applying a first paste obtained by kneading first materials containing the metal oxide microparticles that reflect the light from the semiconductor light-emitting element and glass powders to the back surface of the substrate and then, heating the first paste; and forming a second film including the glass frit by applying a second paste obtained by kneading second materials containing the glass powders to a surface of the first film on an opposite side to the substrate and then, heating the second paste, and a second volume concentration of the glass frit in the second film is larger than a first volume concentration of the glass frit in the first film. ### Claim 19 (depends on 18) The mounting substrate manufacturing method according to claim 18, further comprising: plating the electrode. ### Claim 20 A light-emitting module, comprising: a mounting substrate including a substrate and a reflective film on a back surface of the substrate; a wiring pattern on the front surface of the substrate; and a semiconductor light-emitting element on a front surface of the substrate, wherein the substrate transmits light from the semiconductor light-emitting element, the reflective film is a multilayer film, the multilayer film includes a first film that reflects the light, which is emitted from the semiconductor light-emitting element and is transmitted through the substrate, toward the front surface of the substrate and a second film on the first film on an opposite side to the substrate, the first film includes metal oxide microparticles that reflect the light from the semiconductor light-emitting element and a first glass frit, the second film includes a second glass frit, and a second volume concentration of the second glass frit in the second film is larger than a first volume concentration of the first glass frit in the first film. ### Claim 21 (depends on 20) The light-emitting module according to claim 20, further comprising: a sealing member on the front surface of the substrate, the sealing member sealing the semiconductor light-emitting element, wherein the sealing member and the substrate have a substantially same refraction index. ### Claim 22 (depends on 20) The light-emitting module according to claim 20, further comprising: an electrode on the front surface of the substrate, the electrode being electrically connected to the semiconductor light-emitting element, wherein the electrode is a transparent conductive film. ### Claim 23 (depends on 20) An illumination device comprising the light-emitting according to claim 20.