# US 8,541,799 B2 · Light-emitting element package and fabrication method thereof

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- Number: US 8,541,799 B2
- Document ID: US8541799B2
- Status: Granted
- Kind: B2
- Application number: 13/113,081
- Filed: 2011-05-23
- Published: 2011-12-01
- Granted: 2013-09-24
- Earliest claimed: 2010-05-31
- Assignees: Advanced Optoelectronic Technology, Inc.
- Applicants: Min-Tsun Hsieh; Wen-Liang Tseng; Lung-Hsin Chen; Chih-Yung Lin; Ching-Lien Yeh; Chi-Wei Liao
- Inventors: Min-Tsun Hsieh; Wen-Liang Tseng; Lung-Hsin Chen; Chih-Yung Lin; Ching-Lien Yeh; Chi-Wei Liao
- Web page: https://patentgrep.com/patent/US8541799B2

## CPC

- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/853: characterised by their shape
- H10H 20/0362: {of encapsulations}
- H10H 20/872: {Periodic patterns for optical field-shaping, e.g. photonic bandgap structures}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.

## Claims

### Claim 1

A fabrication method for a light-emitting element package, the method comprising:
providing a plurality of light-emitting elements to mount on a substrate;
providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold, the upper mold being disposed above the plurality of light-emitting elements, and the bottom mold being disposed below the substrate and attaching the substrate;
forming a plurality of photonic crystal patterns on the upper mold and the bottom mold, each photonic crystal pattern consisting of a plurality of photonic crystals;
filling package materials into the high precision wafer level mold module to obtain package members with photonic crystal patterns;
removing the high precision level mold module to obtain a semi-finished product; and
dicing the semi-finished product to obtain a plurality of light-emitting element packages each including one of the light-emitting elements.

### Claim 2 (depends on 1)

The fabrication method for a light-emitting element package of claim 1, wherein the photonic crystal patterns of the wafer level mode are made by electroforming process or high intensity beam process.

### Claim 3 (depends on 1)

The fabrication method for a light-emitting element package of claim 1, wherein the package material is glass, silicon, PC or PMMA.

### Claim 4 (depends on 1)

The fabrication method for a light-emitting element package of claim 1, wherein the package material comprises phosphor elements.

### Claim 5 (depends on 1)

The fabrication method for a light-emitting element package of claim 1, wherein the package member comprises optical diffusing agents.

### Claim 6 (depends on 1)

The fabrication method for a light-emitting element package of claim 1, wherein a distribution density of the photonic crystal patterns is gradient distribution.

### Claim 7 (depends on 1)

The fabrication method for a light-emitting element package of claim 1, wherein a distribution density of the photonic crystal patterns is corresponding to light distribution of a corresponding light-emitting element.