# US 8,541,786 B2 · Packaged semiconductor device having improved locking properties

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- Number: US 8,541,786 B2
- Document ID: US8541786B2
- Status: Granted
- Kind: B2
- Application number: 13/164,268
- Filed: 2011-06-20
- Published: 2011-12-22
- Granted: 2013-09-24
- Earliest claimed: 2010-06-22
- Assignees: NXP B.V.
- Applicants: Rene Wilhelmus Johannes Maria van den Boomen; Jan van Kempen
- Inventors: Rene Wilhelmus Johannes Maria van den Boomen; Jan van Kempen
- Web page: https://patentgrep.com/patent/US8541786B2

## CPC

- H10W 74/01: Manufacture or treatment
- H10W 70/042: {Etching}
- H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)}
- H10W 72/30: Die-attach connectors
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H10W 72/01331: {using blanket deposition}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07353: {changes in shapes}
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/5434: {the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/931: {Shapes of bond pads}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The invention relates to semiconductor devices and methods of manufacturing. In certain embodiments, a semiconductor device can include: a) a contact pad with pre-shaped sidewalls; b) a semiconductor chip having a terminal that is electrically connected to the contact pad, and c) a protective compound covering the semiconductor chip and at least part of the sidewalls. The sidewall can be rough or the sidewall can be tapered to facilitate locking of the contact pad into the compound.

## Claims

### Claim 1

A method of manufacturing a semiconductor device including a semiconductor chip, the method comprising:
providing a substrate having a first side and a second side opposite to the first side;
providing a photoresist layer on the first side of the substrate, the photoresist layer including an opening extending to the substrate and having pre-shaped sidewalls;
filling the opening with an electrically conductive material for defining a contact pad to be formed for being connected to a terminal of a semiconductor chip, wherein the contact pad has further sidewalls that correspond to the pre-shaped sidewalls of the photoresist layer, wherein the sidewalls of the photoresist layer are pre-shaped such that the further sidewalls contained within the opening are formed with a protrusion in a direction having a component orthogonal to the respective sidewall;
removing the photoresist layer;
providing the semiconductor chip and mounting said semiconductor chip on the first side of the substrate such that one terminal is electrically connected to the contact pad; and
providing a protective compound covering the substrate and the semiconductor chip and at least the protrusion of at least one of the further sidewalls of the contact pad, the further sidewalls and the protective compound being configured and arranged to secure the semiconductor chip to the contact pad.

### Claim 2 (depends on 1)

The method as claimed in claim 1, wherein, in the providing of the photoresist layer, the photoresist layer comprises particles of non-photoresist material, wherein the pre-shaped sidewalls have a rough surface because of the presence of the particles in the photoresist layer in the pre-shaped sidewalls, wherein, in the filling of the opening, the further sidewalls have a further rough surface corresponding with the rough surface of the photoresist layer.

### Claim 3 (depends on 2)

The method as claimed in claim 2, wherein the particles are one of flake-shaped and fiber-shaped.

### Claim 4 (depends on 3)

The method as claimed in claim 3, wherein the particles include at least one of epoxy and glass.

### Claim 5 (depends on 1)

The method as claimed in claim 1, wherein, in the providing of the photoresist layer, the pre-shaped sidewalls of opening are formed in a tapered fashion such that a width of the opening increases towards the first side, wherein, in the filling of the opening, the further sidewalls are formed in a tapered fashion corresponding with the sidewalls of the photoresist layer.

### Claim 6 (depends on 5)

The method as claimed in claim 5, wherein, in the provision of the substrate, the substrate comprises a substantially flat surface at the first side.

### Claim 7 (depends on 1)

The method as claimed in claim 1, further comprising:
etching the second side of the substrate.

### Claim 8 (depends on 1)

The method as claimed in claim 1, further comprising, before the providing of the protective compound , providing a wire bond between the terminal of the semiconductor chip and the contact pad of the substrate.

### Claim 9

A semiconductor device comprising:
a contact pad including electrically conductive material having a first side and a second side, the contact pad having at least one tapered sidewall such that a width of the contact pad increases towards the first side;
a semiconductor chip being provided at the first side of the contact pad, the semiconductor chip having a terminal that is electrically connected to the contact pad; and
a protective compound covering the semiconductor chip and at least part of the at least one tapered sidewall, the protective compound and the at least one tapered sidewall being configured and arranged to secure the semiconductor chip to the contact pad.

### Claim 10

A semiconductor device comprising:
a contact pad including electrically conductive material and having a first side and a second side, the contact pad having at least one roughened sidewall;
a semiconductor chip being provided at the first side of the contact pad, the semiconductor chip having a terminal that is electrically connected to the contact pad; and
a protective compound covering the semiconductor chip and at least part of the at least one roughened sidewall, the protective compound and the at least one roughened sidewall being configured and arranged to secure the semiconductor chip to the contact pad.

### Claim 11 (depends on 10)

The semiconductor device as claimed in claim 10, wherein the roughened sidewall includes particles, wherein the particles include material that is different from the electrically conductive material of the contact pad.

### Claim 12 (depends on 11)

The semiconductor device as claimed in claim 11, wherein the material of the particles includes at least one of epoxy and glass.

### Claim 13 (depends on 10)

A printed-circuit board comprising the semiconductor device as claimed in claim 10, and further comprising a carrier with terminals for receiving said semiconductor device.

### Claim 14 (depends on 9)

The semiconductor device as claimed in claim 9, wherein the contact pad further includes a portion that extends laterally beyond the semiconductor chip, and further including a bond wire that electrically connects the terminal to the contact pad at a location on the first side of the portion of the contact pad that extends laterally beyond the semiconductor chip.

### Claim 15 (depends on 14)

The semiconductor device as claimed in claim 14, wherein the contact pad further includes a portion that extends laterally beyond the semiconductor chip, and further includes a portion of the protective compound that is in contact with the second side of the contact pad and extends laterally along the second side of the contact pad from the sidewall of the contact pad toward a center point of the contact pad.

### Claim 16 (depends on 9)

The semiconductor device as claimed in claim 9, further including a contact region electrically coupled to the second side of the contact pad and laterally supported by a portion of the protective compound, the contact region having a solder bump configured and arranged for connection to a printed circuit board.

### Claim 17 (depends on 10)

The semiconductor device as claimed in claim 10, wherein the contact pad further includes a portion that extends laterally beyond the semiconductor chip, and further includes a bond wire that electrically connects the terminal to the contact pad at a location on the first side of the portion of the contact pad that extends laterally beyond the semiconductor chip.

### Claim 18 (depends on 17)

The semiconductor device as claimed in claim 17, wherein the contact pad further includes a portion that extends laterally beyond the semiconductor chip, and further includes a portion of the protective compound that is in contact with the second side of the contact pad and extends laterally along the second side of the contact pad from the sidewall of the contact pad toward a center point of the contact pad.

### Claim 19 (depends on 10)

The semiconductor device as claimed in claim 10, further including a contact region electrically coupled to the second side of the contact pad and laterally supported by a portion of the protective compound, the contact region having a solder bump configured and arranged for connection to a printed circuit board.