# US 8,541,693 B2 · Wiring board and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,693 B2 - Document ID: US8541693B2 - Status: Granted - Kind: B2 - Application number: 13/012,873 - Filed: 2011-01-25 - Published: 2011-10-06 - Granted: 2013-09-24 - Earliest claimed: 2010-03-31 - Assignees: Ibiden Co., Ltd. - Applicants: Hideyuki Wakita; Akihide Kawaguchi - Inventors: Hideyuki Wakita; Akihide Kawaguchi - Web page: https://patentgrep.com/patent/US8541693B2 ## CPC - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 2201/09181: Notches in edge pads - H05K 2201/09509: Blind vias, i.e. vias having one side closed - H05K 2201/096: Vertically aligned vias, holes or stacked vias - H05K 2201/09709: Staggered pads, lands or terminals; Parallel conductors in different planes - H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical - Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc. - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate. ## Claims ### Claim 1 A wiring board, comprising: a core substrate having a first surface and a second surface on an opposite side of the first surface; a first laminated structure formed on the first surface of the core substrate and comprising a plurality of conductive layers and a plurality of insulation layers; and a second laminated structure formed on the second surface of the core substrate and comprising a plurality of conductive layers and a plurality of insulation layers, wherein the core substrate has a hole and a connection conductor comprising a plating filling the hole, the plurality of insulation layers of the first laminated structure has a plurality of holes and a plurality of connection conductors, the connection conductors of the first laminated structure are stacked one over another and comprise platings filling the holes in the first laminated structure, respectively, the plurality of insulation layers of the second laminated structure has a plurality of holes and a plurality of connection conductors, the connection conductors of the second laminated structure are stacked one over another and comprise platings filling the holes in the second laminated structure, respectively, the connection conductors of the first and second laminated structures are stacked on the connection conductor of the core substrate, the plurality of connection conductors of the first laminated structure includes an outer-layer connection conductor formed in an outer insulation layer of the insulation layers of the first laminated structure, the plurality of connection conductors of the second laminated structure includes an outer-layer connection conductor formed in an outer insulation layer of the insulation layers of the second laminated structure, and the outer-layer connection conductors of the first and second laminated structures have positions which are shifted in a substantially same direction from a position of the connection conductor of the core substrate. ### Claim 2 (depends on 1) The wiring board according to claim 1, wherein the connection conductors of the first and second laminated structures are shifted from the connection conductor of the core substrate in the substantially same direction. ### Claim 3 (depends on 2) The wiring board according to claim 2, wherein the connection conductors of the first and second laminated structures have positions shifted in a substantially constant direction from the core substrate. ### Claim 4 (depends on 3) The wiring board according to claim 3, wherein the positions of the connection conductors of the first and second laminated structures are shifted at shifting angles which are substantially constant along the substantially constant direction. ### Claim 5 (depends on 3) The wiring board according to claim 3, wherein the positions of the connection conductors of the first and second laminated structures are shifted at a same shifting angle along the substantially constant direction. ### Claim 6 (depends on 3) The wiring board according to claim 3, wherein the positions of the connection conductors of the first and second laminated structures are shifted with shifting amounts which are substantially constant along the substantially constant direction. ### Claim 7 (depends on 3) The wiring board according to claim 3, wherein the positions of the connection conductors of the first and second laminated structures are shifted with a same shifting amount along the substantially constant direction. ### Claim 8 (depends on 1) The wiring board according to claim 1, wherein the connection conductors of the first and second laminated structures have positions shifted in a substantially constant direction from the core substrate. ### Claim 9 (depends on 3) The wiring board according to claim 3, wherein the positions of the connection conductors of the first and second laminated structures are shifted with shifting amounts which are in an approximate range of 1˜25 μm. ### Claim 10 (depends on 1) The wiring board according to claim 1, wherein the core substrate, the first laminated structure and the second laminated structure has a through hole penetrating through the core substrate, the first laminated structure and the second laminated structure, and the through hole has a plating formed on a wall surface of the through hole. ### Claim 11 (depends on 10) The wiring board according to claim 10, wherein the through hole has an elliptical opening shape. ### Claim 12 (depends on 1) The wiring board according to claim 1, wherein the core substrate, the first laminated structure and the second laminated structure has a notch formed through the core substrate, the first laminated structure and the second laminated structure, and the notch has a plating formed on a wall surface of the notch. ### Claim 13 (depends on 12) The wiring board according to claim 12, wherein the notch has an elliptical opening shape. ### Claim 14 (depends on 1) The wiring board according to claim 1, wherein each of the insulation layers of the first laminated structure and the second laminated structure comprises a core material impregnated with a resin. ### Claim 15 (depends on 1) The wiring board according to claim 1, wherein the plurality of conductive layers of the first laminated structure comprises three or more conductive layers, the plurality of conductive layers of the second laminated structure comprises three or more conductive layers, the plurality of insulation layers of the first laminated structure comprises three or more insulation layers, the plurality of insulation layers of the second laminated structure comprises three or more insulation layers, the conductive layers and insulation layers of the first laminated structure are alternately laminated, and the conductive layers and insulation layers of the second laminated structure are alternately laminated. ### Claim 16 A method for manufacturing a wiring board, comprising: preparing a core substrate having a hole and a connection conductor comprising a plating filling the hole; forming a plurality of insulation layers on a first surface of the core substrate and a second surface of the core substrate, respectively; forming a plurality of holes in the plurality of insulation layers, respectively; filling platings in the holes in the insulation layers such that a plurality of connection conductors are formed; and forming a plurality of conductive layers on the plurality of insulation layers, respectively, wherein the forming of the insulation layers, the filling of the platings and the forming of the conductive layers are carried out in repetition such that a first laminated structure comprising a plurality of conductive layers, a plurality of insulation layers and a plurality of connection conductors is formed on the first surface of the core substrate, that a second laminated structure comprising a plurality of conductive layers, a plurality of insulation layers and a plurality of connection conductors is formed on the second surface of the core substrate, that the connection conductors of the first and second laminated structures are stacked on the connection conductor of the core substrate, that the plurality of connection conductors of the first laminated structure includes an outer-layer connection conductor formed in an outer insulation layer of the insulation layers of the first laminated structure, that the plurality of connection conductors of the second laminated structure includes an outer-layer connection conductor formed in an outer insulation layer of the insulation layers of the second laminated structure, and that the outer-layer connection conductors of the first and second laminated structures have positions which are shifted in a substantially same direction from a position of the connection conductor of the core substrate. ### Claim 17 (depends on 16) The method for manufacturing a wiring board according to claim 16, wherein the repetition comprises forming the connection conductors of the first and second laminated structures such that the connection conductors of the first and second laminated structures are shifted from the connection conductor of the core substrate in the substantially same direction. ### Claim 18 (depends on 17) The method for manufacturing a wiring board according to claim 17, wherein the repetition comprises forming the connection conductors of the first and second laminated structures such that the connection conductors of the first and second laminated structures have positions shifted in a substantially constant direction from the core substrate. ### Claim 19 (depends on 16) The method for manufacturing a wiring board according to claim 16, wherein the repetition comprises forming the plurality of conductive layers of the first laminated structure which comprises three or more conductive layers and forming the plurality of insulation layers of the first laminated structure which comprises three or more insulation layers such that the conductive layers and insulation layers of the first laminated structure are alternately laminated and forming the plurality of conductive layers of the second laminated structure which comprises three or more conductive layers and forming the plurality of insulation layers of the second laminated structure which comprises three or more insulation layers such that the conductive layers and insulation layers of the second laminated structure are alternately laminated. ### Claim 20 (depends on 16) The method for manufacturing a wiring board according to claim 16, further comprising: forming a through hole penetrating through the core substrate, the first laminated structure and the second laminated structure; and forming a plating on a wall surface of the through hole. ### Claim 21 (depends on 20) The method for manufacturing a wiring board according to claim 20, wherein the forming of the plating on the wall surface of the through hole and the filling the hole in the insulation layers of the first and second laminated structures at outermost position are simultaneously conducted. ### Claim 22 (depends on 16) The method for manufacturing a wiring board according to claim 16, further comprising: forming a notch formed through the core substrate, the first laminated structure and the second laminated structure; and forming a plating on a wall surface of the notch.