# US 8,541,691 B2 · Heat resistant substrate incorporated circuit wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,691 B2 - Document ID: US8541691B2 - Status: Granted - Kind: B2 - Application number: 12/952,759 - Filed: 2010-11-23 - Published: 2011-03-17 - Granted: 2013-09-24 - Earliest claimed: 2006-05-02 - Assignees: Ibiden Co., Ltd. - Applicants: Takashi Kariya; Toshiki Furutani; Takeshi Kawanishi - Inventors: Takashi Kariya; Toshiki Furutani; Takeshi Kawanishi - Web page: https://patentgrep.com/patent/US8541691B2 ## CPC - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H10W 70/095: {of vias therein} - H10W 70/635: {Through-vias} - H10W 70/685: comprising multiple insulating layers - H05K 1/112: {directly combined with via connections} - H05K 3/4688: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)} - H05K 2201/0187: with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties - H05K 2201/10674: Flip chip - H10W 70/655: Fan-out layouts - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/90: Bond pads, in general - H10W 72/9415: {relative to the surface, e.g. recessed, protruding} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer. ## Claims ### Claim 1 A circuit wiring board comprising: a wiring board structure; and a heat resistant substrate accommodated in an accommodating portion of the wiring board structure and comprising a core substrate, a built-up wiring layer formed over a first surface of the core substrate, and a second built-up wiring layer formed over a second surface of the core substrate on an opposite side of the first surface, wherein the core substrate and built-up wiring layer of the heat resistant substrate are positioned in the accommodating portion of the wiring board structure, the built-up wiring layer comprises a conductive layer and an interlayer resin insulating layer, the core substrate has a plurality of through hole conductors formed at a pitch and penetrating from the first surface of the core substrate to the second surface of the core substrate, the heat resistant substrate comprises a plurality of connecting pads formed on the second build-up wiring layer, the connecting pads are electrically connected to the plurality of through hole conductors, and the connecting pads are positioned at a pitch which is larger than the pitch of the through hole conductors of the core substrate. ### Claim 2 (depends on 1) The circuit wiring board according to claim 1, wherein the plurality of through hole conductors is formed at a pitch of between 30 μm to 200 μm. ### Claim 3 (depends on 1) The circuit wiring board according to claim 1, wherein the heat resistant substrate further comprises a plurality of loading pads formed on a surface of the built-up wiring board such that the loading pads are positioned to be connected to a plurality of electrodes of an electronic component, respectively. ### Claim 4 (depends on 1) The circuit wiring board according to claim 1, further comprising a solder resist layer provided on the built-up wiring layer. ### Claim 5 (depends on 1) The circuit wiring board according to claim 1, further comprising a wiring substrate formed over the second built-up layer, wherein the heat resistant substrate and the wiring substrate form a surface substantially flat with each other. ### Claim 6 (depends on 1) The circuit wiring board according to claim 1, wherein the plurality of through hole conductors comprises a plurality of plated conductors formed inside a plurality of holes formed through the core substrate, respectively. ### Claim 7 (depends on 1) The circuit wiring board according to claim 1, wherein the built-up wiring layer comprises a plurality of via hole conductors formed through the interlayer resin insulating layer and connected to the conductive layer, and the built-up wiring layer further comprises a plurality of connections formed on the plurality of via hole conductors. ### Claim 8 (depends on 1) The circuit wiring board according to claim 1, wherein the core substrate has a thermal expansion coefficient which is lower than a thermal expansion coefficient of the interlayer resin insulating layer of the built-up wiring layer. ### Claim 9 (depends on 1) The circuit wiring board according to claim 1, wherein the core substrate comprises a single board. ### Claim 10 (depends on 1) The circuit wiring board according to claim 1, wherein the core substrate has a thermal expansion coefficient in a range between 3.0 ppm to 10 ppm. ### Claim 11 (depends on 1) The circuit wiring board according to claim 1, wherein the heat resistant substrate further comprises a plurality of loading pads formed on a surface of the built-up wiring layer such that the loading pads are positioned to be connected to a plurality of electrodes of an electronic component, the core substrate has a plurality of through hole conductors, and the loading pads are positioned at a pitch which is smaller than a pitch of the through hole conductors of the core substrate. ### Claim 12 (depends on 1) The circuit wiring board according to claim 1, further comprising: a first electronic component provided on the surface of the wiring board structure; and a second electronic component provided on the surface of the wiring board structure. ### Claim 13 (depends on 12) The circuit wiring board according to claim 12, wherein the first electronic component and the second electronic component are positioned directly over the heat resistant substrate. ### Claim 14 (depends on 12) The circuit wiring board according to claim 12, wherein the first electronic component is electrically connected to the conductive layer of the built-up wiring layer, and the second electronic component is electrically connected to the conductive layer of the built-up wiring layer. ### Claim 15 (depends on 12) The circuit wiring board according to claim 12, wherein the first electronic component and the second electronic component are electrically connected such that a signal is exchanged between the first electronic component and the second electronic component. ### Claim 16 (depends on 1) The circuit wiring board according to claim 1, further comprising an electronic component provided on the surface of the wiring board structure and electrically connected to the conductive layer of the built-up wiring layer. ### Claim 17 A circuit wiring board comprising: a wiring board structure; and a heat resistant substrate accommodated in an accommodating portion of the wiring board structure and comprising a core substrate, a first face built-up wiring layer formed on a first surface of the core substrate and a second face built-up wiring layer formed on a second surface of the core substrate on an opposite side of the first surface, wherein the core substrate and first and second face built-up wiring layers of the heat resistant substrate are positioned in the accommodating portion of the wiring board structure, each of the first and second face built-up wiring layers comprises a conductive layer and an interlayer resin insulating layer, the heat resistant substrate comprises a plurality of connecting pads formed on a surface of the second face built-up wiring layer and a plurality of loading pads formed on a surface of the first face built-up wiring layer such that the loading pads are positioned to be connected to a plurality of electrodes of an electronic component, the core substrate has a plurality of through hole conductors penetrating through the core substrate, the plurality of loading pads and connecting pads are electrically connected to the plurality of through hole conductors, and a pitch of the loading pads, a pitch of the through hole conductors, and a pitch of the connecting pads are increased in an order of the loading pads, the through hole conductors and the connecting pads. ### Claim 18 (depends on 17) The circuit wiring board according to claim 17, wherein the plurality of through hole conductors is formed at a pitch of between 30 μm to 200 μm. ### Claim 19 (depends on 17) The circuit wiring board according to claim 17, further comprising a solder resist layer provided on the first face built-up wiring layer. ### Claim 20 (depends on 17) The circuit wiring board according to claim 17, further comprising a wiring substrate formed over the second face built-up layer, wherein the heat resistant substrate and the wiring substrate form a surface substantially flat with each other. ### Claim 21 (depends on 17) The circuit wiring board according to claim 17, wherein the plurality of through hole conductors comprises a plurality of plated conductors formed inside a plurality of holes formed through the core substrate, respectively. ### Claim 22 (depends on 17) The circuit wiring board according to claim 17, wherein at least one of the first and second face built-up wiring layers comprises a plurality of via hole conductors formed through the interlayer resin insulating layer and connected to the conductive layer, and at least one of the first and second face built-up wiring layers further comprises a plurality of connections formed on the plurality of via hole conductors. ### Claim 23 (depends on 17) The circuit wiring board according to claim 17, wherein the core substrate has a thermal expansion coefficient which is lower than a thermal expansion coefficient of the interlayer resin insulating layer of at least one of the first and second face built-up wiring layers. ### Claim 24 (depends on 17) The circuit wiring board according to claim 17, wherein the core substrate comprises a single board. ### Claim 25 (depends on 17) The circuit wiring board according to claim 17, wherein the core substrate has a thermal expansion coefficient in a range between 3.0 ppm to 10 ppm. ### Claim 26 (depends on 17) The circuit wiring board according to claim 17, further comprising: a first electronic component provided on the surface of the wiring board structure; and a second electronic component provided on the surface of the wiring board structure. ### Claim 27 (depends on 26) The circuit wiring board according to claim 26, wherein the first electronic component and the second electronic component are positioned directly over the heat resistant substrate. ### Claim 28 (depends on 26) The circuit wiring board according to claim 26, wherein the first electronic component is electrically connected to the conductive layer of the first face built-up wiring layer, and the second electronic component is electrically connected to the conductive layer of the first face built-up wiring layer. ### Claim 29 (depends on 26) The circuit wiring board according to claim 26, wherein the first electronic component and the second electronic component are electrically connected such that a signal is exchanged between the first electronic component and the second electronic component. ### Claim 30 (depends on 17) The circuit wiring board according to claim 17, further comprising an electronic component provided on the surface of the wiring board structure and electrically connected to the conductive layer of the first face built-up wiring layer.