# US 8,541,689 B2 · Method for removing a part of a planar material layer and multilayer structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,689 B2 - Document ID: US8541689B2 - Status: Granted - Kind: B2 - Application number: 12/449,611 - Filed: 2008-01-30 - Published: 2010-03-11 - Granted: 2013-09-24 - Earliest claimed: 2007-02-16 - Assignees: AT & S Austria Technologie & Systemtecknik Aktiengesellschaft - Applicants: Gerald Weidinger; Markus Leitgeb; Johannes Stahr; Günther Weichslberger; Andreas Zluc - Inventors: Gerald Weidinger; Markus Leitgeb; Johannes Stahr; Günther Weichslberger; Andreas Zluc - Web page: https://patentgrep.com/patent/US8541689B2 ## CPC - E05B 1/0092: {Moving otherwise than only rectilinearly or only rotatively (E05B5/003 takes precedence)} - H05K 1/00: Printed circuits - E05B 1/0053: {Handles or handle attachments facilitating operation, e.g. by children or burdened persons (foot-operation E05B53/001)} - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)} - H05K 2201/09127: PCB or component having an integral separable or breakable part - Y10T 29/49155: Manufacturing circuit on or in base - E05B: LOCKS; ACCESSORIES THEREFOR; HANDCUFFS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board. ## Claims ### Claim 1 A method for removing a subportion or part of a substantially flat or planar material layer which is bonded with at least one further substantially flat or planar material layer in a bonding procedure, wherein, in the region or zone of the subsequent removal of the subportion, an area kept free from direct bonding between the material layers is provided by applying an adhesion-preventing material preventing the adhesion of the material layers to be bonded and wherein the substantially flat material layers to be bonded are formed by layers of a multilayer printed circuit board, wherein, the adhesion-preventing material has a softening or melting point of at least 100° C. resulting in hardening of any further layers of adhesive being use and resulting in a liquefaction of the adhesion-preventing material during a further increase of the temperature during a connecting or pressing process, and wherein the adhesion-preventing material is applied as a waxy paste as a dispersion in a solvent and the adhesion-preventing material comprises a separating component and a binder. ### Claim 2 (depends on 1) The method according to claim 1, wherein the adhesion-preventing material is applied by a printing process selected from the group consisting of screen-printing, stencil-printing, offset printing, flexoprinting, tampon printing, and ink-jet printing and optionally subjected to a subsequent drying and/or curing process. ### Claim 3 (depends on 1) The method according to claim 1, wherein the adhesion-preventing material comprises a difference in polarity relative to the adjoining substantially flat material layers. ### Claim 4 (depends on 1) The method according to claim 1, wherein the adhesion-preventing material comprises hydrocarbon waxes and oils, waxes and oils based on polyethylene or polypropylene compounds, waxes and oils based on organic polyfluoro compounds, esters of fatty acids and alcohols or polyamides, silicoorganic compounds and/or mixtures thereof. ### Claim 5 (depends on 1) The method according to claim 1, wherein the adhesion-preventing material is provided with inorganic and/or organic fillers and additives. ### Claim 6 (depends on 1) The method according to claim 1, wherein the adhesion-preventing material is applied in a layer thickness of less than 25 μm. ### Claim 7 (depends on 1) The method according to claim 1, wherein the material layers to be bonded are bonded by a lamination process. ### Claim 8 (depends on 1) The method according to claim 1, wherein edge regions of the subportion to be removed are defined and/or removed by milling, scratching, or cutting. ### Claim 9 (depends on 6) The method according to claim 6, wherein the softening or melting point of the adhesion-preventing material is at least 120° C. ### Claim 10 A multilayer structure formed by at least two substantially flat or planar material layers to be bonded with each other, wherein, in the region of a subportion or part to be removed after having realized the bonding between the material layers, an area kept free from direct bonding between the material layers to be bonded is provided by the application of a material preventing the adherence of the material layers to be bonded and wherein the substantially flat material layers to be bonded are formed by layers of a multilayer printed circuit board, wherein the adhesion-preventing material is comprised of a wax paste and that the wax of the adhesion-preventing material has a softening or melting point of at least 100° C. resulting in hardening of any further layers of adhesive being use and resulting in a liquefaction of the adhesion-preventing material during a further increase of the temperature during a connecting or pressing process, and wherein the adhesion-preventing material is applied as a waxy paste as a dispersion in a solvent and the adhesion-preventing material comprises a separating component and a binder. ### Claim 11 (depends on 10) The multilayer structure according to claim 10, wherein the adhesion-preventing material comprises hydrocarbon waxes and oils, waxes and oils based on polyethylene or polypropylene compounds, waxes and oils based on organic polyfluoro compounds, esters of fatty acids and alcohols or polyamides, silicoorganic compounds and/or mixtures thereof. ### Claim 12 (depends on 10) The multilayer structure according to claim 10, wherein the adhesion-preventing material is provided with inorganic and/or organic fillers and additives. ### Claim 13 (depends on 10) The multilayer structure according to claim 10, wherein the adhesion-preventing material is applied in a layer thickness of less than 25 μm. ### Claim 14 (depends on 10) The multilayer structure according to claim 10, wherein the material layers to be bonded are bonded by a lamination process. ### Claim 15 (depends on 10) The multilayer structure according to claim 10, wherein edge regions of the subportion to be removed are definable and/or removable by milling, scratching, or cutting. ### Claim 16 A method for the production of a multilayer printed circuit board comprising the steps of removing a subportion or part of a substantially flat or planar material layer which is bonded with at least one further substantially flat or planar material layer in a bonding procedure, wherein, in the region or zone of the subsequent removal of the subportion, an area kept free from direct bonding between the material layers is provided by applying an adhesion-preventing material preventing the adhesion of the material layers to be bonded and wherein the substantially flat material layers to be bonded are formed by layers of the multilayer printed circuit board, wherein, the adhesion-preventing material has a softening or melting point of at least 100° C. resulting in hardening of any further layers of adhesive being use and resulting in a liquefaction of the adhesion-preventing material during a further increase of the temperature during a connecting or pressing process, and wherein the adhesion-preventing material is applied as a waxy paste as a dispersion in a solvent and the adhesion-preventing material comprises a separating component and a binder. ### Claim 17 (depends on 16) The method according to claim 16 for the production of cavities in the printed multilayer circuit board. ### Claim 18 (depends on 16) The method according to claim 16 for the production of at least one channel in the printed multilayer circuit board. ### Claim 19 (depends on 16) The method according to claim 16 for the non-bonding of at least one element in the interior or within internal layers of the multilayer printed circuit board. ### Claim 20 (depends on 16) The method according to claim 16 for the production of offset and/or stepped subportion of the printed multilayer circuit board. ### Claim 21 (depends on 16) The method use according to claim 16 for the production of the printed multilayer circuit board that is rigid-flexible.