# US 8,541,688 B2 · Circuit connection material, circuit member connecting structure and method of connecting circuit member > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,688 B2 - Document ID: US8541688B2 - Status: Granted - Kind: B2 - Application number: 12/769,925 - Filed: 2010-04-29 - Published: 2010-08-19 - Granted: 2013-09-24 - Earliest claimed: 2010-04-29 - Assignees: Hitachi Chemical Company, Ltd. - Applicants: Motohiro Arifuku; Nichiomi Mochizuki; Takashi Nakazawa; Kouji Kobayashi; Tohru Fujinawa; Takashi Tatsuzawa - Inventors: Motohiro Arifuku; Nichiomi Mochizuki; Takashi Nakazawa; Kouji Kobayashi; Tohru Fujinawa; Takashi Tatsuzawa - Web page: https://patentgrep.com/patent/US8541688B2 ## CPC - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - C08G 18/4213: {from terephthalic acid and dialcohols} - C08G 18/672: {Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen} - C09J 175/16: having terminal carbon-to-carbon unsaturated bonds - C08L 75/06: from polyesters - C08L 2666/20: Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof - H01R 12/52: connecting to other rigid printed circuits or like structures - H05K 3/361: {Assembling flexible printed circuits with other printed circuits} - Y10T 29/49126: Assembling bases - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. ## Claims ### Claim 1 A circuit-connecting material for connection between circuit members, wherein each circuit member has a board and a circuit electrode formed on a primary surface of said board, the material comprising: (a) an adhesive composition that cures in response to light or heat; and (b) an organic compound comprising a urethane group and an ester group, wherein the organic compound has a weight-average molecular weight of 5,000 to 100,000. ### Claim 2 (depends on 1) A circuit-connecting material according to claim 1, wherein said adhesive composition includes a radical polymerizing compound and a radical initiator that generates radicals in response to heat or light. ### Claim 3 (depends on 2) A circuit-connecting material according to claim 2, wherein said radical polymerizing compound comprises a phosphoric acid ester compound with an acrylate group or methacrylate group. ### Claim 4 (depends on 1) A circuit-connecting material according to claim 1, wherein the glass transition temperature of said organic compound is 50° C. or higher. ### Claim 5 (depends on 1) A circuit-connecting material according to claim 1, wherein said organic compound includes either or both of an aromatic group and a cyclic aliphatic group. ### Claim 6 (depends on 1) A circuit-connecting material according to claim 1, wherein the weight-average molecular weight of said organic compound is 5,000 to 60,000. ### Claim 7 (depends on 1) A circuit-connecting material according to claim 1, which further comprises conductive particles. ### Claim 8 (depends on 1) A circuit-connecting material according to claim 1, wherein the weight-average molecular weight of said organic compound is 27,000 to 60,000. ### Claim 9 (depends on 1) A cured product of a circuit-connecting material according to claim 1, wherein the cured product of the circuit-connecting material electrically connects a first circuit member and a second circuit member, wherein the first circuit member has a first board and a first circuit electrode formed on a primary surface of the first board, and the second circuit member has a second board and a second circuit electrode formed on a primary surface of the second board. ### Claim 10 (depends on 1) A circuit member connection method comprising the steps of: providing a first circuit member provided with a first board and a first circuit electrode formed on a primary surface of the first board, a first layer made of a circuit-connecting material according to claim 1, and a second circuit member provided with a second board and a second circuit electrode formed on a primary surface of the second board; and heating and pressing the first circuit member, the first layer and the second circuit member as a laminate prepared by laminating the first circuit member, the first layer and the second circuit member in that order with the first circuit electrode and the second circuit electrode opposing each other in order to connect the first circuit member and the second circuit member so that the first circuit electrode and the second circuit electrode are electrically connected. ### Claim 11 (depends on 10) A circuit member connection method according to claim 10, wherein a surface of at least one of said first circuit electrode and said second circuit electrode comprises a material including at least one substance selected from the group consisting of gold, silver, tin, platinum-group metals and indium tin oxide. ### Claim 12 (depends on 10) A circuit member connection method according to claim 10, wherein at least one of said first board and said second board is a board formed of a material comprising one or more substances selected from the group consisting of polyethylene terephthalate, polyethersulfone, epoxy resins, acrylic resins, polyimide resins and glass. ### Claim 13 (depends on 10) A circuit member connection method according to claim 10, wherein a second layer comprising one or more resins selected from the group consisting of silicone resins, acrylic resins and polyimide resins is formed between at least one of said first circuit member and said second circuit member and the first layer made of said circuit-connecting material. ### Claim 14 A circuit member connection structure comprising: (a) a first circuit member comprising a first board and a first circuit electrode formed on a primary surface of the first board; and (b) a second circuit member comprising a second board and a second circuit electrode formed on a primary surface of the second board, wherein the first circuit member and the second circuit member are connected by a circuit-connecting member made of a cured product of a circuit-connecting material formed between the first circuit member and the second circuit member so that the first circuit electrode and the second circuit electrode are opposing each other and are electrically connected, wherein the circuit-connecting material comprises i. an adhesive composition that cures in response to light or heat; and ii. an organic compound comprising a urethane group and an ester group, wherein the organic compound has a weight-average molecular weight of 5,000 to 100,000. ### Claim 15 (depends on 14) A circuit member connection structure according to claim 14, wherein a surface of at least one of the first circuit electrode and the second circuit electrode comprises a second material containing at least one substance selected from the group consisting of gold, silver, tin, platinum-group metals and indium tin oxide. ### Claim 16 (depends on 14) A circuit member connection structure according to claim 14, wherein at least one of the first board and the second board is a board made of a second material comprising one or more components selected from the group consisting of polyethylene terephthalate, polyethersulfone, epoxy resins, acrylic resins, polyimide resins and glass. ### Claim 17 (depends on 14) A circuit member connection structure according to claim 14, wherein a layer comprising one or more resins selected from the group consisting of silicone resins, acrylic resins and polyimide resins is formed between at least one of said first circuit member and said second circuit member and said circuit-connecting member.