# US 8,541,686 B2 · Wiring member and method for producing the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,541,686 B2
- Document ID: US8541686B2
- Status: Granted
- Kind: B2
- Application number: 12/444,773
- Filed: 2009-04-08
- Published: 2013-07-04
- Granted: 2013-09-24
- Earliest claimed: 2006-10-10
- Assignees: Shin-Etsu Polymer Co., Ltd.
- Applicants: Toshiyuki Kawaguchi; Kazutoki Tahara; Tsutomu Saga; Mitsuaki Negishi
- Inventors: Toshiyuki Kawaguchi; Kazutoki Tahara; Tsutomu Saga; Mitsuaki Negishi
- Web page: https://patentgrep.com/patent/US8541686B2

## CPC

- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- H05K 1/0234: {Resistors or by disposing resistive or lossy substances in or near power planes (H05K1/0246 takes precedence)}
- H05K 1/167: {incorporating printed resistors}
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/0215: Metallic fillers
- H05K 2201/0326: Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
- H05K 2201/09309: Core having two or more power planes; Capacitive laminate of two power planes
- Y10T 29/49126: Assembling bases
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.

## Claims

### Claim 1

A wiring member comprising:
a copper foil;
a noise suppressing layer comprising a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm;
an organic polymer film provided between the copper foil and the noise suppressing layer; and
an insulating adhesive layer provided between the copper foil and the organic polymer film.

### Claim 2 (depends on 1)

The wiring member according to claim 1,
wherein a total thickness of the organic polymer film and the insulating adhesive layer is within the range of 3 to 30 μm.

### Claim 3 (depends on 1)

The wiring member according to claim 1,
wherein the noise suppressing layer has a pattern, in which the layer is partially removed.

### Claim 4

A wiring member comprising:
a copper foil;
an organic polymer film;
a noise suppressing layer provided between the copper foil and the organic polymer film, the noise suppressing layer including a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; and
an insulating adhesive layer provided between the copper foil and the noise suppressing layer.

### Claim 5 (depends on 4)

The wiring member according to claim 4,
wherein a thickness of the insulating adhesive layer is within the range of 1 to 25 μm.

### Claim 6 (depends on 4)

The wiring member according to claim 4,
wherein the noise suppressing layer has a pattern, in which portions of the noise suppressing layer are removed.

### Claim 7 (depends on 1)

The wiring member according to claim 1,
wherein a thickness of the organic polymer film is within the range of 1 to 20 μm.

### Claim 8 (depends on 3)

A method for producing the wiring member of claim 3, the method comprising the following steps (a), (b), and (c):
(a) a step of forming a noise suppressing layer by physically depositing a metallic material or a conductive ceramic on an organic polymer film;
(b) a step of adhering a copper foil and the organic polymer film using an insulating adhesive; and
(c) a step of removing portions of the noise suppressing layer.

### Claim 9 (depends on 8)

The method according to claim 8,
wherein the steps (a), (b), and (c) are conducted in this order.

### Claim 10 (depends on 8)

The method according to claim 8,
wherein the steps (a), (c), and (b) are conducted in this order.

### Claim 11 (depends on 8)

The method according to claim 8,
wherein the steps (b), (a), and (c) are conducted in this order.

### Claim 12 (depends on 6)

A method for producing the wiring member of claim 6, the method comprising the following steps (a), (c), and (b′):
(a) a step of forming a noise suppressing layer by physically depositing a metallic material or a conductive ceramic on an organic polymer film;
(c) a step of removing portions of the noise suppressing layer; and
(b′) a step of adhering a copper foil and the noise suppressing layer using an insulating adhesive,
wherein the steps (a), (c), and (b′) are conducted in this order.