# US 8,541,310 B2 · CMP compositions containing a soluble peroxometalate complex and methods of use thereof

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- Number: US 8,541,310 B2
- Document ID: US8541310B2
- Status: Granted
- Kind: B2
- Application number: 11/800,188
- Filed: 2007-05-04
- Published: 2008-11-06
- Granted: 2013-09-24
- Earliest claimed: 2007-05-04
- Assignees: Cabot Microelectronics Corporation
- Applicants: Daniela White; John Parker
- Inventors: Daniela White; John Parker
- Web page: https://patentgrep.com/patent/US8541310B2

## CPC

- H10P 52/403: {of conductive or resistive materials}
- C09G 1/02: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES

## Abstract

The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises (a) a catalytic oxidant comprising a water-soluble peroxometalate complex, an oxidizable precursor of a peroxometalate complex, or a combination thereof, (b) a particulate abrasive; and (c) an aqueous carrier. The peroxometalate complex and the precursor thereof each have a reduced form that is oxidizable by hydrogen peroxide to regenerate the peroxometalate complex during chemical-mechanical polishing. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided.

## Claims

### Claim 1

A chemical-mechanical polishing (CMP) method for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide, comprising the steps of:
(a) contacting a surface of the ruthenium-containing substrate with a polishing pad and an aqueous CMP composition in the presence of hydrogen peroxide; and
(b) causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition and hydrogen peroxide in contact with the surface between the pad and the substrate for a time period sufficient to abrade at least a portion of the ruthenium present in the substrate from the surface;
wherein the CMP composition comprises (i) a catalytic oxidant comprising a water-soluble peroxometalate complex and an oxidizable precursor of a peroxometalate complex, the peroxometalate complex and the precursor thereof each having a reduced form that is oxidizable by hydrogen peroxide to generate the peroxometalate complex during chemical-mechanical polishing, wherein the water soluble peroxometalate complex is selected from the group consisting of an isoperoxotungstate compound, a peroxotitanate compound and a titanium hydroperoxosilicate compound, and wherein the oxidizable precursor of the peroxometalate complex is selected from the group consisting of an acidic tungsten-containing compound and a titanate compound; (ii) a particulate abrasive; and (iii) an aqueous carrier.

### Claim 2 (depends on 1)

The method of claim 1 wherein the particulate abrasive is present in the composition in an amount in the range of about 0.5 to about 10 percent by weight.

### Claim 3 (depends on 1)

The method of claim 1 wherein the particulate abrasive has a mean particle size in the range of about 5 to about 50 nm.

### Claim 4 (depends on 1)

The method of claim 1 wherein the catalytic oxidant is present in the composition in an amount in the range of about 0.05 to about 1 percent by weight.

### Claim 5 (depends on 1)

The method of claim 1 wherein the peroxometalate complex comprises an isoperoxotungstate compound.

### Claim 6 (depends on 1)

The method of claim 1 wherein the peroxometalate complex comprises a peroxotitanate compound.

### Claim 7 (depends on 1)

The method of claim 1 wherein peroxometalate complex comprises a titanium hydroperoxosilicate compound.

### Claim 8 (depends on 1)

The method of claim 1 wherein the oxidizable precursor of the peroxometalate complex comprises an acidic tungsten-containing compound.

### Claim 9 (depends on 8)

The method of claim 8 wherein the acidic tungsten-containing compound is selected from the group consisting of tungstic acid, polytungstic acid, phosphotungstic acid, and a combination of two or more of the foregoing.

### Claim 10 (depends on 1)

The method of claim 1 wherein the oxidizable precursor of the peroxometalate complex comprises a titanate compound.

### Claim 11 (depends on 10)

The method of claim 10 wherein the titanate compound is selected from the group consisting of a titanium(IV) citrate complex, a titanium(IV) lactate complex, and a combination thereof.