# US 8,541,301 B2 · Reduction of pore fill material dewetting > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,301 B2 - Document ID: US8541301B2 - Status: Granted - Kind: B2 - Application number: 13/180,734 - Filed: 2011-07-12 - Published: 2013-01-17 - Granted: 2013-09-24 - Earliest claimed: 2011-07-12 - Assignees: International Business Machines Corporation - Applicants: Geraud Jean-Michel Dubois; Theo J. Frot; Teddie P. Magbitang; Willi Volksen - Inventors: Geraud Jean-Michel Dubois; Theo J. Frot; Teddie P. Magbitang; Willi Volksen - Web page: https://patentgrep.com/patent/US8541301B2 ## CPC - H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass - H10W 20/072: {of dielectric parts comprising air gaps} - H10W 20/093: {by modifying materials of the dielectric parts} - H10W 20/096: {by contacting with gases, liquids or plasmas} - H10W 20/097: {by thermally treating} - H10W 20/46: comprising air gaps - H10P 14/665: {Porous materials} - H10W 20/081: {by forming openings in the dielectric parts} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In one exemplary embodiment, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material includes a polymer and at least one additive, where the at least one additive includes at least one of a surfactant, a high molecular weight polymer and a solvent; and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer. ## Claims ### Claim 1 A method comprising: providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent, and where the at least one additive is operable to reduce or eliminate dewetting of excess filling material; and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer. ### Claim 2 (depends on 1) The method of claim 1, where the at least one additive is operable to raise a dewet start temperature of the filling material, where the dewet start temperature is a temperature at which the filling material on the surface of the first layer begins to dewet. ### Claim 3 (depends on 1) The method of claim 1, where the at least one additive is thermally removable. ### Claim 4 (depends on 1) The method of claim 1, where the at least one additive comprises a solvent having a boiling temperature between 100° C. and 300° C. ### Claim 5 (depends on 1) The method of claim 1, where the at least one additive comprises a solvent having a boiling temperature between 150° C. and 250° C. ### Claim 6 (depends on 1) The method of claim 1, where the at least one additive comprises a high molecular weight polymer that is too large to penetrate the pores of the dielectric material. ### Claim 7 (depends on 1) The method of claim 1, where the at least one additive comprises a high molecular weight polymer having molecular weight about or greater than 2000 g/mol. ### Claim 8 (depends on 1) The method of claim 1, where the at least one additive comprises a high molecular weight polymer having a molecular weight about or greater than 10000 g/mol. ### Claim 9 (depends on 1) The method of claim 1, where the at least one additive is selected based on one or more of: a thickness of the first layer, the dielectric material, the filling material, a temperature used to heat the structure and enable the filling material to at least partially fill the plurality of pores, a heating time, and pore size of the plurality of pores. ### Claim 10 (depends on 1) The method of claim 1, where the at least one additive comprises the surfactant. ### Claim 11 (depends on 1) The method of claim 1, where the at least one additive comprises the high molecular weight polymer. ### Claim 12 (depends on 1) The method of claim 1, where the at least one additive comprises a high boiling point solvent. ### Claim 13 (depends on 1) The method of claim 1, where heating the structure results in the residual filling material being uniformly left across an area of the surface of the first layer. ### Claim 14 A method comprising: providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent having a boiling temperature greater than 150° C., where the at least one additive is operable to raise a dewet start temperature of the filling material, where the dewet start temperature is a temperature at which the surface of the first layer begins to dewet, where the at least one additive is thermally removable, where the high molecular weight polymer has a molecular weight about or greater than 2000 g/mol, where the at least one additive is selected based on one or more of: a thickness of the first layer, the dielectric material, the filling material, a temperature used to heat the structure and enable the filling material to at least partially fill the plurality of pores, a heating time, and pore size of the plurality of pores; and applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on surface of the first layer. ### Claim 15 (depends on 14) The method of claim 14, where the at least one additive is thermally removable. ### Claim 16 (depends on 14) The method of claim 14, where heating the structure results in the residual filling material being uniformly left across an area of the surface of the first layer.