# US 8,541,165 B2 · Resin film forming method

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- Number: US 8,541,165 B2
- Document ID: US8541165B2
- Status: Granted
- Kind: B2
- Application number: 13/156,193
- Filed: 2011-06-08
- Published: 2011-12-15
- Granted: 2013-09-24
- Earliest claimed: 2010-06-15
- Assignees: Fujitsu Limited
- Applicants: Tomomi Sato
- Inventors: Tomomi Sato
- Web page: https://patentgrep.com/patent/US8541165B2

## CPC

- G03F 7/168: {Finishing the coated layer, e.g. drying, baking, soaking}
- B05D 1/005: {Spin coating}
- B82Y 10/00: Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
- B82Y 40/00: Manufacture or treatment of nanostructures
- G03F 7/11: having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)}
- B05D 3/12: by mechanical means
- B05D 2350/60: Adding a layer before coating
- G02B 1/105
- G02B 1/14: Protective coatings, e.g. hard coatings
- G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping}
- G03F 7/022: Quinonediazides (G03F7/075 takes precedence)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

A resin film forming method for forming a resin film on a substrate includes forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond the resin film to be formed on the substrate to the substrate, carrying out a treatment on the substrate to remove an edge of the intermediate layer from an edge of the substrate, forming the resin film on the substrate by spin coating, chemically bonding the resin film to the substrate and hardening the resin film, and removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film.

## Claims

### Claim 1

A resin film forming method for forming a resin film over a substrate, the method comprising:
forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond the resin film to be formed over the substrate to the substrate;
covering the intermediate layer with a mask in a region which does not include an edge of the intermediate layer and carrying out an ashing process on the edge of the intermediate layer;
forming the resin film over the substrate by spin coating;
chemically bonding the resin film to the substrate and hardening the resin film; and
removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film.

### Claim 2 (depends on 1)

The resin film forming method according to claim 1, wherein a masking material deposited layer is formed on the edge of the substrate during the ashing process from the mask that is used for the ashing.

### Claim 3 (depends on 2)

The resin film forming method according to claim 2, wherein the masking material deposited layer includes components that do not chemically bond to the resin film.

### Claim 4 (depends on 1)

The resin film forming method according to claim 1, wherein the intermediate layer includes a silane coupling agent, and the mask includes a fluorine rubber or a silicone rubber.

### Claim 5 (depends on 1)

The resin film forming method according to claim 1, wherein ultrasonic vibrations of 28 to 100 kHz are applied to the resin film to remove the edge of the resin film.

### Claim 6

A pattern forming method for forming a pattern over a substrate, the method comprising:
forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond a resin film to be formed over the substrate to the substrate;
covering the intermediate layer with a mask in a region which does not include an edge of the intermediate layer and carrying out an ashing process on the edge of the intermediate layer;
forming the resin film over the substrate by spin coating;
chemically bonding the resin film to the substrate and hardening the resin film;
removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film; and
forming a pattern on the resin film by pressing the resin film on a mold and transferring a mold pattern thereto.

### Claim 7

A pattern forming method of forming a pattern over a substrate, the method comprising:
forming an intermediate layer on the substrate which includes an inorganic composition as a main component to chemically bond a resin film to be formed over the substrate to the substrate;
covering the intermediate layer with a mask in a region which does not include an edge of the intermediate layer and carrying out an ashing process on the edge of the intermediate layer;
forming the resin film over the substrate by spin coating;
chemically bonding the resin film to the substrate and hardening the resin film;
removing an edge of the resin film from the edge of the substrate by applying vibrations to the hardened resin film; and
forming a pattern on the resin film by adhering an exposure mask to the resin film and exposing the resin film.