# US 8,541,099 B2 · Heat-resistant resin

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- Number: US 8,541,099 B2
- Document ID: US8541099B2
- Status: Granted
- Kind: B2
- Application number: 12/350,764
- Filed: 2009-01-08
- Published: 2009-05-21
- Granted: 2013-09-24
- Earliest claimed: 2004-10-19
- Assignees: Nitto Denko Corporation
- Applicants: Hirofumi Fujii; Yoshio Terada; Kazumasa Igarashi
- Inventors: Hirofumi Fujii; Yoshio Terada; Kazumasa Igarashi
- Web page: https://patentgrep.com/patent/US8541099B2

## CPC

- C08G 73/1025: {polymerised by radiations}
- C08G 73/10: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08K 3/04: Carbon
- C08K 5/3432: Six-membered rings
- C08L 79/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- G03F 7/0387: {Polyamides or polyimides}
- Y10T 428/254: Polymeric or resinous material
- Y10T 428/2822: Wax containing
- Y10T 428/31663: As siloxane, silicone or silane
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

## Claims

### Claim 1

A dust removal member comprising a silicon wafer and a thermoplastic resin formed on the silicon wafer, wherein the thermoplastic resin has a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher.

### Claim 2 (depends on 1)

The dust removal member according to claim 1, wherein the thermoplastic resin has no sea-island structure of 0.1 μm or larger and is transparent.

### Claim 3 (depends on 1)

The dust removal member according to claim 1, wherein the thermoplastic resin has a siloxane content of lower than 10% by mass.

### Claim 4 (depends on 1)

The dust removal member according to claim 1, wherein the thermoplastic resin is a polyimide resin obtainable by reacting a tetracarboxylic dianhydride with a diamine compound, said diamine compound being a diamine compound which has two ends having an amine structure and has a polyether structure.

### Claim 5 (depends on 4)

The dust removal member according to claim 4, wherein the diamine compound, which has two ends having an amine structure and has a polyether structure, has a number-average molecular weight of 500 or higher; and wherein the resin contains the polyether structure of the diamine compound in a proportion of 40 to 60% by weight.

### Claim 6 (depends on 1)

The dust removal member according to claim 1, which the thermoplastic resin further comprises a photosensitizing agent.

### Claim 7 (depends on 6)

The dust removal member according to claim 6, wherein the thermoplastic resin further comprises:
a 1,4-dihydropyridine compound represented by the formula (I):
wherein R1 to R5 each independently represent a hydrogen atom or an organic group having 1 to 4 carbon atoms.

### Claim 8 (depends on 1)

The dust removal member according to claim 1, wherein the thermoplastic resin further comprises a carbon powder.