# US 8,541,096 B2 · Printed circuit board and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,541,096 B2 - Document ID: US8541096B2 - Status: Granted - Kind: B2 - Application number: 12/654,446 - Filed: 2009-12-18 - Published: 2011-03-17 - Granted: 2013-09-24 - Earliest claimed: 2009-09-15 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Mi Sun Hwang; Jae Joon Lee; Myung Sam Kang - Inventors: Mi Sun Hwang; Jae Joon Lee; Myung Sam Kang - Web page: https://patentgrep.com/patent/US8541096B2 ## CPC - H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer - H05K 2201/0352: Differences between the conductors of different layers of a multilayer - H05K 2201/068: wherein the coefficient of thermal expansion is important - H05K 2201/09136: Means for correcting warpage - Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc. - Y10T 29/49126: Assembling bases - Y10T 29/49128: Assembling formed circuit to base - Y10T 29/49165: by forming conductive walled aperture in base - Y10T 428/24917: including metal layer - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided. ## Claims ### Claim 1 A printed circuit board comprising: a core layer in which is disposed a bending prevention portion of at least two layers that is interposed between a plurality of insulating members and comprises metal layers having different thermal expansion coefficients; a circuit pattern formed so as to have a desired pattern on at least one inner side of the core layer and an outer side of the core layer; and an insulating layer formed on the core layer and including an opening portion that exposes the circuit pattern. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein the bending prevention portion comprises a first bending prevention layer having a first thermal expansion coefficient and a second bending prevention layer having a second thermal expansion coefficient that is higher than the first thermal expansion coefficient, and the first bending prevention layer is formed such that the first bending prevention layer is closer to the opening portion side than the second bending prevention layer. ### Claim 3 (depends on 1) The printed circuit board of claim 1, wherein the bending prevention portion comprises a second bending prevention layer having a second thermal expansion coefficient and a first bending prevention layer having a first thermal expansion coefficient that is lower than the second thermal expansion coefficient, and the second bending prevention layer is formed where the second bending prevention layer is closer to the opening portion side than the first bending prevention layer. ### Claim 4 (depends on 2) The printed circuit board of claim 2, wherein the first bending prevention layer is formed from invar or nickel (Ni), and the second bending prevention layer is formed from copper or copper alloy. ### Claim 5 (depends on 3) The printed circuit board of claim 3, wherein the first bending prevention layer is formed from invar or nickel (Ni), and the second bending prevention layer is formed from copper or copper alloy. ### Claim 6 (depends on 1) The printed circuit board of claim 1, wherein the insulating layer is a solder resist that is patterned so as to expose the circuit pattern. ### Claim 7 (depends on 1) The printed circuit board of claim 1, further comprising a through hole formed by perforating at least one face of the core layer.