# US 8,540,894 B2 · Polishing composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,894 B2 - Document ID: US8540894B2 - Status: Granted - Kind: B2 - Application number: 12/733,913 - Filed: 2008-09-29 - Published: 2010-11-25 - Granted: 2013-09-24 - Earliest claimed: 2007-09-28 - Assignees: Nitta Haas Incorporated - Applicants: Takayuki Matsushita; Masashi Teramoto; Haruki Nojo - Inventors: Takayuki Matsushita; Masashi Teramoto; Haruki Nojo - Web page: https://patentgrep.com/patent/US8540894B2 ## CPC - C09G 1/02: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} - C09K 3/1463: {Aqueous liquid suspensions} - C09K 13/02: containing an alkali metal hydroxide - H10P 90/129: {by polishing} - C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A polishing composition that can improve polishing property without foaming is provided. A polishing composition includes a pH regulator, a water-soluble polymer compound, and a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to the two nitrogens of the alkylene structure, the block type polyether having a bond of an oxyethylene group and an oxypropylene group: where R represents an alkylene group represented by CnH2n, in which n is an integer of 1 or more. ## Claims ### Claim 1 A polishing composition, consisting essentially of: a pH regulator, a water-soluble polymer compound, and a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to at least one of the two nitrogens of the alkylene structure, the block type polyether having a bond of an oxyethylene group and an oxypropylene group, a content of the compound being within a range of from 0.0001 to 1% by weight based on a total weight of the polishing composition, where R represents an alkylene group represented by CnH2n, in which n is an integer of 1 or more. ### Claim 2 (depends on 1) The polishing composition of claim 1, wherein the at least one block type polyether is bonded to only one nitrogen of the alkylene diamine structure, and a carbon number n of the alkyl group R in the alkylene diamine structure satisfies the following formula (2), 1≦n≦2a+2b (2) where a represents a number of the oxyethylene group in the block type polyether and b represents a number of the oxypropylene group therein. ### Claim 3 (depends on 2) The polishing composition of claim 2, wherein in the compound the number a of the oxyethylene group in the block type polyether is within a range of from 1 to 500, and the number b of the oxypropylene group therein is within a range of from 1 to 200. ### Claim 4 (depends on 1) The polishing composition of claim 1, wherein in the compound, a mass ratio between the oxyethylene group and the oxypropylene group in the block type polyether is within a range of from 10:90 to 95:5. ### Claim 5 (depends on 1) The polishing composition of claim 1, wherein the water-soluble polymer compound is water-soluble polysaccharides or polyvinyl alcohols. ### Claim 6 (depends on 1) The polishing composition of claim 1, further comprising abrasive grains. ### Claim 7 (depends on 2) The polishing composition of claim 2, wherein in the compound, a mass ratio between the oxyethylene group and the oxypropylene group in the block type polyether is within a range of from 10:90 to 95:5. ### Claim 8 (depends on 3) The polishing composition of claim 3, wherein in the compound, a mass ratio between the oxyethylene group and the oxypropylene group in the block type polyether is within a range of from 10:90 to 95:5. ### Claim 9 (depends on 2) The polishing composition of claim 2, wherein the water-soluble polymer compound is water-soluble polysaccharides or polyvinyl alcohols. ### Claim 10 (depends on 3) The polishing composition of claim 3, wherein the water-soluble polymer compound is water-soluble polysaccharides or polyvinyl alcohols. ### Claim 11 (depends on 4) The polishing composition of claim 4, wherein the water-soluble polymer compound is water-soluble polysaccharides or polyvinyl alcohols. ### Claim 12 (depends on 7) The polishing composition of claim 7, wherein the water-soluble polymer compound is water-soluble polysaccharides or polyvinyl alcohols. ### Claim 13 (depends on 8) The polishing composition of claim 8, wherein the water-soluble polymer compound is water-soluble polysaccharides or polyvinyl alcohols. ### Claim 14 (depends on 2) The polishing composition of claim 2, further comprising abrasive grains. ### Claim 15 (depends on 3) The polishing composition of claim 3, further comprising abrasive grains. ### Claim 16 (depends on 4) The polishing composition of claim 4, further comprising abrasive grains. ### Claim 17 (depends on 5) The polishing composition of claim 5, further comprising abrasive grains. ### Claim 18 (depends on 7) The polishing composition of claim 7, further comprising abrasive grains. ### Claim 19 (depends on 8) The polishing composition of claim 8, further comprising abrasive grains. ### Claim 20 (depends on 9) The polishing composition of claim 9, further comprising abrasive grains. ### Claim 21 (depends on 10) The polishing composition of claim 10, further comprising abrasive grains. ### Claim 22 (depends on 11) The polishing composition of claim 11, further comprising abrasive grains. ### Claim 23 (depends on 12) The polishing composition of claim 12, further comprising abrasive grains. ### Claim 24 (depends on 13) The polishing composition of claim 13, further comprising abrasive grains. ### Claim 25 (depends on 1) The polishing composition of claim 1, wherein at least one block type polyether is bonded to each of the two nitrogens of the alkylene diamine structure, and the carbon number n of the alkyl group R in the alkylene diamine structure satisfies the following formula (3), 1≦n≦2×(2a+2b) (3) where a represents a number of the oxyethylene group in the block type polyether and b represents a number of the oxypropylene group therein.