# US 8,540,857 B1 · Plating method and apparatus with multiple internally irrigated chambers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,857 B1 - Document ID: US8540857B1 - Status: Granted - Kind: B1 - Application number: 13/571,199 - Filed: 2012-08-09 - Granted: 2013-09-24 - Earliest claimed: 2008-12-19 - Assignees: Novellus Systems, Inc. - Applicants: Steven Mayer; Shantinath Ghongadi; Kousik Ganesan; Zhian He; Jingbin Feng - Inventors: Steven Mayer; Shantinath Ghongadi; Kousik Ganesan; Zhian He; Jingbin Feng - Web page: https://patentgrep.com/patent/US8540857B1 ## CPC - C25D 17/001: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells} - C25D 5/08: Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} - C25D 17/002: {Cell separation, e.g. membranes, diaphragms} - C25D 17/008: {Current shielding devices} - C25F 7/00: Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects (for both electrolytic coating and removal C25D); Servicing or operating - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - C25F: PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR ## Abstract An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus. ## Claims ### Claim 1 An apparatus for electroplating a layer of metal onto a work piece surface, the apparatus comprising: (a) a chamber; (b) a membrane separating the chamber into an anolyte chamber and a catholyte chamber; and (c) a catholyte manifold for delivering catholyte to the catholyte chamber, the catholyte manifold comprising a catholyte delivery structure having a plurality of outlet ports and located wholly within the catholyte chamber, wherein the catholyte delivery structure is configured to deliver impinging catholyte onto the membrane during electroplating. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the catholyte delivery structure is further configured to deliver impinging catholyte with turbulence on the membrane during electroplating. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the outlet ports comprise holes. ### Claim 4 (depends on 3) The apparatus of claim 3, wherein the holes have different diameters. ### Claim 5 (depends on 1) The apparatus of claim 1, further comprising a bubble-separation element. ### Claim 6 (depends on 5) The apparatus of claim 5, wherein the bubble-separation element is a bubble-separation manifold. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the catholyte delivery structure comprises one or more flow distribution tubes located immediately above the membrane, each flow distribution tube comprising one or more of the outlet ports. ### Claim 8 (depends on 7) The apparatus of claim 7, wherein a flow distribution tube is located between about two to four tube diameters from the membrane. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein the outlet ports comprise pores. ### Claim 10 (depends on 1) The apparatus of claim 1, further comprising: an anolyte manifold region associated with the anolyte chamber, the anolyte manifold region comprising: an anolyte manifold, and at least one flow distribution tube associated with the anolyte manifold. ### Claim 11 (depends on 1) The apparatus of claim 1, further comprising a wafer holder for maintaining the work piece surface in the catholyte chamber during electroplating. ### Claim 12 (depends on 1) The apparatus of claim 1, further comprising a high resistance virtual anode comprising a plurality of parallel holes and positioned in the catholyte chamber to be (i) proximate and parallel to the work piece during electroplating and (ii) above the catholyte manifold delivery structure. ### Claim 13 (depends on 1) The apparatus of claim 1, further comprising a degasser for degassing electrolyte used in the electroplating. ### Claim 14 An apparatus for electroplating a layer of metal onto a work piece surface, the apparatus comprising: (a) a chamber; (b) a membrane separating the chamber into an anolyte chamber and a catholyte chamber; and (c) a catholyte manifold for delivering catholyte to the catholyte chamber, the catholyte manifold comprising a catholyte delivery structure having a plurality of outlet ports and located wholly within the catholyte chamber; (d) a wafer holder for maintaining the work piece surface in the catholyte chamber during electroplating; and (e) a high resistance virtual anode comprising a plurality of parallel holes and positioned in the catholyte chamber to be (i) proximate and parallel to the work piece during electroplating and (ii) above the catholyte manifold delivery structure. ### Claim 15 (depends on 14) The apparatus of claim 14, wherein the catholyte delivery structure is further configured to deliver impinging catholyte with turbulence on the membrane during electroplating. ### Claim 16 (depends on 14) The apparatus of claim 14, wherein the outlet ports comprise holes. ### Claim 17 (depends on 14) The apparatus of claim 14, wherein the catholyte delivery structure comprises one or more flow distribution tubes located immediately above the membrane, each flow distribution tube comprising one or more of the outlet ports. ### Claim 18 (depends on 14) The apparatus of claim 14, wherein the high resistance virtual anode is positioned to be within 1-5 mm of the work piece during electroplating. ### Claim 19 (depends on 14) The apparatus of claim 14, wherein the high resistance virtual anode has a porosity of about 2-5%. ### Claim 20 A method of electroplating a layer of metal onto a work piece surface, comprising: (a) holding a work piece in a work piece holder of an electroplating apparatus, wherein the apparatus includes a membrane separating the chamber into an anolyte chamber and a catholyte chamber; (b) flowing catholyte through a catholyte manifold and a catholyte delivery structure having a plurality of outlet ports and located wholly within the catholyte chamber, wherein catholyte delivery structure delivers impinging catholyte onto the membrane; and (c) supplying current to the work piece to plate a metal layer onto a work piece surface. ### Claim 21 (depends on 20) The method of claim 20, further comprising removing oxygen from the electrolyte. ### Claim 22 (depends on 20) The method of claim 20, wherein the impinging catholyte is turbulent.