# US 8,540,854 B2 · Apparatus and method for plating substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,854 B2 - Document ID: US8540854B2 - Status: Granted - Kind: B2 - Application number: 12/656,683 - Filed: 2010-02-12 - Published: 2010-08-12 - Granted: 2013-09-24 - Earliest claimed: 2009-02-11 - Assignees: Semes Co., Ltd. - Applicants: Yijung Kim; Eun Su Rho; Jeong Yong Bae - Inventors: Yijung Kim; Eun Su Rho; Jeong Yong Bae - Web page: https://patentgrep.com/patent/US8540854B2 ## CPC - C25D 7/123: {Semiconductors first coated with a seed layer or a conductive layer} - C25D 17/001: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells} - H10P 14/47: Electrolytic deposition, i.e. electroplating; Electroless plating - H10W 20/056: {by filling conductive material into holes, grooves or trenches} - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided are a substrate plating apparatus and a substrate plating method. In the substrate plating apparatus, a substrate support member supports a substrate to allow a plating surface to look up. A plating solution containing positive ions dissolved from a positive electrode is supplied from a plating solution supply member onto the substrate at an upper side of the substrate support member. A plating bath surrounds the substrate support member. The substrate support member is rotated in a state where it is immersed into the plating solution and an additive. The substrate can be supported by the substrate support member without reversing the substrate. Also, a pattern defect due to bubbles generated during a plating process can be prevented. ## Claims ### Claim 1 An apparatus for plating a substrate, comprising: a substrate support member; a plating solution supply member disposed above the substrate support member, the plating solution supply member discharging a plating solution onto a plating surface of the substrate, the plating solution supply member includes: an enclosure having an inner space with opened lower portion and a fluid inlet; a positive electrode disposed in the inner space, the positive electrode providing positive ions into the plating solution; and an ion exchange membrane disposed below the positive electrode and above the opened lower portion, the ion exchange membrane being permeable only to the positive ions; a plating bath configured to receive the plating solution and immerse the substrate support member thereof; and a bowl configured to completely surround the plating bath and recover the plating solution overflowing from the plating bath, wherein the substrate support member includes a support plate to support the substrate and allow the plating solution to be applied onto the plating surface of the substrate. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the substrate support member comprises an annular ring protruding annularly from a top surface of the support plate toward an upper side along an outer circumference of the support plate, the annular ring providing a space in which the substrate is disposed therein. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein the substrate support member further comprises an injection nozzle passing through the support plate and injecting an inert gas onto a non-plated surface of the substrate. ### Claim 4 (depends on 2) The apparatus of claim 2, wherein the support plate has a vacuum suction hole vacuum-adsorbing a non-plated surface of the substrate to support the substrate. ### Claim 5 (depends on 2) The apparatus of claim 2, wherein the substrate support member has a holes vertically passing through the support plate and further comprises a support pin vertically movable along the respective holes and loading/unloading the substrate to/in the space. ### Claim 6 (depends on 2) The apparatus of claim 2, wherein the plating bath surrounds the substrate support member, has an opened upper portion, and has an upper end higher than a top surface of the annular ring. ### Claim 7 (depends on 6) The apparatus of claim 6, further comprising: a plating solution storage part storing the plating solution; a first supply line connecting the plating solution supply member to the plating solution storage part, the first supply line supplying the plating solution to the plating solution supply member; and a second supply line connecting the plating bath to the plating solution storage part, the second supply line supplying the plating solution to the plating bath. ### Claim 8 (depends on 2) The apparatus of claim 2, wherein the plating solution supply member has a bottom surface having a diameter greater than an inner diameter of the annular ring. ### Claim 9 (depends on 1) The apparatus of claim 1, further comprising a porous plate in which a plurality of holes is defined, the porous plate is disposed below the ion exchange membrane. ### Claim 10 (depends on 1) The apparatus of claim 1, further comprising a first driving part vertically moving the substrate support member or the plating solution supply member, the first driving part varying a relative distance between the substrate support member and the plating solution supply member. ### Claim 11 (depends on 9) The apparatus of claim 9, wherein the plating solution supply member further comprises an interception plate for opening and closing the plurality of holes of the porous plate. ### Claim 12 (depends on 1) The apparatus of claim 1, wherein the substrate support member further comprises a metal pin disposed on an outer circumference of the support plate, the metal pin protruding upwardly from a top surface of the support plate, wherein the metal pin contacts the plating surface and is electrically connected to the substrate. ### Claim 13 (depends on 2) The apparatus of claim 2, wherein the substrate support member further comprises a metal pin disposed on the outer circumference of the support plate, the metal pin protruding upwardly from the top surface of the support plate, wherein the metal pin contacts the plating surface and is electrically connected to the substrate. ### Claim 14 (depends on 13) The apparatus of claim 13, wherein the metal pin is disposed on the annular ring. ### Claim 15 (depends on 14) The apparatus of claim 14, wherein the substrate support member further comprises a reinforcement member surrounding an outer surface of the metal pin, the reinforcement member reinforcing strength of the metal pin. ### Claim 16 (depends on 15) The apparatus of claim 15, wherein the reinforcement member comprises a support member comprising a support member protruding upwardly from the top surface of the support plate and an upper member extending from an end of the support member in a direction different from that of the support member, wherein a groove is defined in a lateral surface of the support member in a longitudinal direction, and the groove extends along a bottom surface of the upper member, wherein the metal pin is inserted into the groove. ### Claim 17 (depends on 14) The apparatus of claim 14, further comprising a second driving part rotating the metal pin. ### Claim 18 (depends on 17) The apparatus of claim 17, further comprising a third driving part lifting the meal pin from the top surface of the support plate toward an upper side.