# US 8,540,843 B2 · Plasma chamber top piece assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,843 B2 - Document ID: US8540843B2 - Status: Granted - Kind: B2 - Application number: 12/861,769 - Filed: 2010-08-23 - Published: 2012-02-23 - Granted: 2013-09-24 - Earliest claimed: 2004-06-30 - Assignees: Lam Research Corporation - Applicants: Leonard J. Sharpless; Keith Comendant - Inventors: Leonard J. Sharpless; Keith Comendant - Web page: https://patentgrep.com/patent/US8540843B2 ## CPC - H10P 50/20: Dry etching; Plasma etching; Reactive-ion etching - C03C 15/00: Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) - C03C 17/001: {General methods for coating; Devices therefor} - H01J 37/21: Means for adjusting the focus - H01J 37/321: {the radio frequency energy being inductively coupled to the plasma} - H01J 37/32522: {Temperature} - H10P 14/40: of conductive or resistive materials - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - H10P 72/0434: {mainly by convection} - H10P 95/70: Chemical treatments - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract A plasma processing system for processing a substrate is described. The plasma processing system includes a bottom piece including a chuck configured for holding the substrate. The plasma processing system also includes an induction coil configured to generate an electromagnetic field in order to create a plasma for processing the substrate. The plasma processing system also includes a cover covering at least the induction coil and a heating and cooling system. The top piece coupled to the bottom piece and at least partially covered by the cover, the top piece comprising a first shelf, a second shelf, and a wall; the wall being disposed between the first shelf and the second shelf; a cavity being formed between the first shelf and the second shelf, and between the wall and a portion of the cover; the heating and cooling system being disposed inside the cavity; Wherein, the heating and cooling system is substantially shielded from the electromagnetic field by the top piece, and the top piece substantially complies with a set of SEMI ergonomic safety standards for a part handled by a single person. ## Claims ### Claim 1 A plasma processing system for processing a substrate, comprising: a bottom piece including a chuck configured for holding said substrate; an induction coil configured to generate an electromagnetic field in order to create a plasma for processing said substrate; a cover covering at least said induction coil; a heating and cooling system; and a top piece coupled to said bottom piece and at least partially covered by said cover, said top piece comprising a first shelf a second shelf, and a wall; said wall being disposed between said first shelf and said second shelf, a cavity being formed between said first shelf and said second shelf and between said wall and a portion of said cover; said heating and cooling system being disposed inside said cavity, wherein said heating and cooling system is substantially shielded from said electromagnetic field by said top piece. ### Claim 2 (depends on 1) The plasma processing system of claim 1, wherein the electromagnetic shielding of the heating and cooling system minimizes a distortion of a resulting electric field. ### Claim 3 (depends on 2) The plasma processing system of claim 2, wherein the minimized distortion of the electric field results in an improved uniformity of a density of the created plasma, and in an improved yield. ### Claim 4 (depends on 1) The plasma processing system of claim 1, wherein said first shelf is connected to said wall at a junction, and said heating and cooling system is further disposed at said junction. ### Claim 5 (depends on 1) The plasma processing system of claim 1, wherein said heating and cooling system surrounds at least a portion of said wall. ### Claim 6 (depends on 1) The plasma processing system of claim 1, wherein said cover is coupled to said bottom piece through said second shelf. ### Claim 7 (depends on 1) The plasma processing system of claim 1, wherein said top piece includes an inner surface area exposed to said plasma, where said inner surface area of said top piece is substantially the same as a non-optimized top piece. ### Claim 8 (depends on 1) The plasma processing system of claim 1, wherein said first shelf is disposed above said second shelf. ### Claim 9 (depends on 1) The plasma processing system of claim 1, wherein said first shelf contacts said portion of said cover. ### Claim 10 (depends on 1) The plasma processing system of claim 1, wherein said top piece further comprises a recess portion associated with a reduced weight that is greater than a weight of said top piece. ### Claim 11 (depends on 1) The plasma processing system of claim 1, wherein said top piece further comprises a recess portion associated with a reduced weight that is greater than or equal to 400% of a weight of said top piece. ### Claim 12 (depends on 1) The plasma process system of claim 1, wherein said top piece further comprises a recess portion associated with a reduced heat capacity that is greater than a heat capacity of said top piece. ### Claim 13 (depends on 1) The plasma processing system of claim 1, wherein said top piece further comprises a recess portion associated with a reduced heat capacity that is greater than or equal to 400% of a heat capacity of said top piece. ### Claim 14 (depends on 1) The plasma processing system of claim 1, further comprising a dielectric window disposed between said induction coil and said top piece for protecting said induction coil from said plasma at least a portion of said top piece being disposed between said beating and cooling system and said dielectric window. ### Claim 15 (depends on 1) The plasma processing system of claim 1, wherein a portion of said top piece is positioned between said induction coil and said heating and cooling system. ### Claim 16 A plasma processing system for processing a substrate, the plasma processing system comprising: a bottom piece enclosing a chuck configured for holding said substrate: an induction coil configured to generate an electromagnetic field in order to create a plasma for processing said substrate; a heating and cooling system; and a top piece coupled to said bottom piece, said top piece comprising a first shelf, a second shelf and a wall; said wall being disposed between said first shelf and said second shelf; said first shelf being connected to said wall at a junction; said first shelf said second shelf, and said wall forming a cavity between said first shelf and said second shelf; said heating and cooling system being disposed inside said cavity; said heating and cooling system being further disposed at said junction; wherein said heating and cooling system is substantially shielded from said electromagnetic field by said top piece. ### Claim 17 (depends on 16) The plasma processing system of claim 16, further comprising a cover covering said induction coil and at least partially covering said top piece, wherein said heating and cooling system is further disposed between said wall and a portion of said cover. ### Claim 18 (depends on 16) The plasma processing system of claim 16, wherein said cover is coupled to said bottom piece through said second shelf. ### Claim 19 (depends on 16) The plasma processing system of claim 16, wherein said cover covers said cavity. ### Claim 20 (depends on 16) The plasma processing system of claim 16, wherein said heating and cooling system surrounds at least a portion of said wall.