# US 8,540,840 B2 · Method of making high temperature resistant models or tools

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- Number: US 8,540,840 B2
- Document ID: US8540840B2
- Status: Granted
- Kind: B2
- Application number: 12/724,742
- Filed: 2010-03-16
- Published: 2010-09-16
- Granted: 2013-09-24
- Earliest claimed: 2004-11-17
- Assignees: Huntsman Advanced Materials Americas LLC
- Applicants: Matthew Cleaver
- Inventors: Matthew Cleaver
- Web page: https://patentgrep.com/patent/US8540840B2

## CPC

- B29C 33/565: {Consisting of shell-like structures supported by backing material}
- B29C 64/141: using only solid materials
- B32B 3/12: characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/20: using fillers, pigments, thixotroping agents
- B32B 27/26: using curing agents
- B32B 27/38: comprising epoxy resins
- C08G 59/50: Amines
- B29C 2033/385: {by laminating a plurality of layers}
- B32B 2250/42: Alternating layers, e.g. ABAB(C), AABBAABB(C)
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/26: Polymeric coating
- B32B 2307/306: Resistant to heat
- B32B 2605/08: Cars
- B32B 2605/18: Aircraft
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A method of making High Temperature Resistant Models and Tools is provided. An assembly of substrates can be formed with intermediate adhesive layer of curable paste and same curable paste can be used as topcoat or sealer. The curable paste can be machine dispensed from a mixer mixing 2 components composition. The composition can contain a resin, a filler, a chemical thixotropy agent, a latent hardener and another hardener. The method provides easy and cost-effective manufacture of models or tools.

## Claims

### Claim 1

A method of producing a model or tool comprising the sequential steps of:
(a) mixing a first component containing a curable epoxy resin and a thixotropic agent with a second component containing a hardener system comprising at least one polyethyleneimine, at least one other amine having at least two amino hydrogen groups and a complex of a Lewis acid and a Lewis base having latent reactivity in a mix block to form a curable paste wherein the curable paste has a density of between 1.1-1.6 g/cm3;
(b) machine dispensing the curable paste on an outer surface of a substructure in the form of a continuous layer;
(c) curing the continuous layer of curable paste at room temperature;
(d) post-curing the layer of paste at a temperature of at least 50° C.; and
(e) machining the cured continuous layer to produce the model or tool
wherein the thixotropic agent comprises hydrophilic fumed silica, the Lewis acid is BX3 AlX3, FeX3, FeX2, ZnX2, TiX3 or TiX4 where X independently represents a C1-6 alkyl group, C1-6 alkoxy group, hydrogen, bromine, iodine or fluorine atom provided that when the Lewis acid is BX3 no X represents a fluorine atom, the Lewis base is ammonia or a compound of the formula Z(Ra)3 in which Z is nitrogen or phosphorus and each Ra independently represents a hydrogen atom; an alkyl group having from 1 to 20 carbon atoms optionally substituted by one or more phenyl groups in which each phenyl group may be optionally substituted by one or more C1-12 alkyl groups and/or halogen atoms; a phenyl group optionally substituted by one or more C1-12 alkyl groups and/or halogen atoms; a C5-7 cycloalkyl group; or two Ra's together represent an alkylene group having from 4 to 6 carbon atoms one or more of which may be replaced by an oxygen or a sulphur atom and the curable paste after curing has a heat deflection temperature above 100° C.

### Claim 2 (depends on 1)

The method of claim 1, wherein the final cured model or tool is machined to form a model or tool for producing laminated composites.

### Claim 3

A curable seamless modelling paste comprising:
(a) an epoxy resin;
(b) a thixotropic agent comprising hydrophilic fumed silica; and
(c) a hardener system containing at least one polyethyleneimine compound, at least one other amine having at least two amino hydrogen groups to effect curing at room temperature, and a complex of a Lewis acid and a Lewis base having latent reactivity to effect curing at a temperature of at least 50° C. wherein the Lewis acid is BX3, AlX3, FeX3, FeX2, ZnX2, TiX3 or TiX4 where X independently represents a C1-6 alkyl group, C1-6 alkoxy group, hydrogen, bromine, iodine or fluorine atom provided that when the Lewis acid is BX3 no X represents a fluorine atom and the Lewis base is ammonia or a compound of the formula Z(Ra)3 in which Z is nitrogen or phosphorus and each Ra independently represents a hydrogen atom; an alkyl group having from 1 to 20 carbon atoms optionally substituted by one or more phenyl groups in which each phenyl group may be optionally substituted by one or more C1-12 alkyl groups and/or halogen atoms; a phenyl group optionally substituted by one or more C1-12 alkyl groups and/or halogen atoms; a C5-7 cycloalkyl group; or two Ra's together represent an alkylene group having from 4 to 6 carbon atoms one or more of which may be replaced by an oxygen or a sulphur atom
and wherein the curable seamless modelling paste has a density of between 1.1-1.6 g/cm3 and the curable seamless modelling paste after curing has a heat deflection temperature above 100° C.

### Claim 4 (depends on 3)

The paste of claim 3 wherein the hydrophilic fumed silica is present at an amount of 1% to 20% by weight, based on the weight of the epoxy resin.

### Claim 5 (depends on 3)

The paste of claim 3 wherein the polyethyleneimine compound is present at an amount from 0.2 to 2 parts by weight, per 100 parts by weight of the epoxy resin.